Wheel Controller Immersion Cooling for Low-Airflow EV Assemblies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuits in electric vehicles, particularly those controlling wheel assemblies, face challenges with cooling due to remote location from centralized systems, leading to inefficiencies in heat dissipation, especially in areas with insufficient airflow.
Innovation Solution
Implementing a liquid cooling system where the wheel controller is integrated into or attached to the vehicle's suspension system, utilizing immersion cooling with dielectric coolant that transitions to gas/vapor and condenses back to liquid, and using laser heating for bonding components without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the wheel controller is remotely located near the wheel assembly, then the cooling efficiency deteriorates due to insufficient airflow, but the localization of heat-generating components improves
Solution Approach 1:
The patent implements a liquid cooling system using a coolant circulation pump and coolant channels to transport cooling fluid directly to heat-generating components in the wheel controller, replacing inadequate air cooling with an efficient hydraulic cooling mechanism
Solution Approach 2:
The wheel controller is integrated into the suspension system by mounting it on the suspension knuckle, combining the electronic control unit with the mechanical suspension structure to achieve compact localization near the wheel assembly
2Device complexity
If the wheel controller is integrated into the suspension system, then the device complexity reduces, but the manufacturing precision requirements increase
Solution Approach 1:
The wheel controller housing is integrated with the suspension knuckle as a single assembly, merging electronic housing and mechanical suspension components into one unified structure that reduces overall system complexity
Solution Approach 2:
The suspension knuckle serves dual functions: mechanical suspension support and thermal management housing for the wheel controller, with integrated coolant channels that perform both structural and cooling roles
3Strength
If laser heating is used for bonding components, then the bonding strength improves, but the risk of damaging the integrated circuit increases
Solution Approach 1:
The laser heating process applies heat locally and selectively to specific bonding areas rather than uniformly heating the entire integrated circuit, concentrating thermal energy only where bonding is required to preserve component integrity
Solution Approach 2:
Traditional mechanical or thermal bonding methods are replaced with laser-based bonding, using optical energy to create precise localized heat zones that enable strong bonding without the need for mechanical pressure or widespread thermal exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools the wheel controller by transferring heat through vaporization and condensation of coolant, allowing operation in regions with limited airflow, and integrating structural and cooling components into a single unit.
Implementation Method 1
the increasing temperature of the dielectric coolant resulting in the dielectric coolant transforming from a liquid to a gas and/or vapor
Implementation Method 2
The coolant transfers heat to the housing of the wheel controller, which in turn transfers heat to the surrounding environment
Implementation Method 3
the gas and/or vapor coolant condenses when transferring heat to the housing and migrates back to the pool of liquid coolant
Implementation Method 4
directed laser heating to heat a bonding material (for example, solder) and the surfaces of the integrated circuit and the component being mounted
Data Source
AI summary
Embodiments of the present disclosure include apparatuses and methods for cooling an electric wheel controller are disclosed. Embodiments include an integrated circuit that controls the rotation of a wheel immersed in liquid coolant. During operation the temperature of the integrated circuit increases and the liquid coolant absorbs heat form the integrated circuit. The heated liquid coolant can then transfer heat to a housing that houses the integrated circuit and liquid coolant. In some embodiments the liquid coolant reaches temperatures that result in the liquid coolant transitioning to a gas and/or vapor. The gas and/or vapor coolant can move to portions of the housing with no liquid and transfer heat to the housing. The gas and/or vapor coolant can cool to a liquid state and move back to the pool of liquid coolant. In some embodiments a heat sink with optional fins can be soldered to the integrated circuit.