White CSP Display Pixels With Wavelength Conversion for Uniform Color
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Solution Overview
Problem
Light-emitting diode displays face issues such as uneven illumination, electrical controlling difficulties, and high manufacturing costs due to the use of red, green, and blue light-emitting diode chips.
Innovation Solution
A display device with chip-scale packaged white light-emitting units, each comprising a light-emitting diode chip covered by a wavelength conversion film that converts blue or UV light into white light, and a color filter layer with red, green, and blue color resists to produce various colors, eliminating the need for separate red, green, and blue units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If red, green, and blue light-emitting diode chips are used to form pixels, then full-color display is achieved, but illumination uniformity deteriorates and manufacturing cost increases
Solution Approach 1:
The invention segments the color generation function by using a single blue light-emitting diode chip combined with a wavelength conversion film containing red, green, and blue phosphors. Each phosphor material segment contributes a specific color component, and their combination produces full-color display while maintaining uniform illumination from a single light source.
Solution Approach 2:
The wavelength conversion film employs composite materials consisting of multiple phosphor materials (red phosphor, green phosphor, and blue phosphor) combined with a resin matrix. This composite structure converts blue light into a full-spectrum white light that maintains illumination uniformity while enabling full-color display through the color filter layer.
2Adaptability or versatility
If red, green, and blue light-emitting diode chips are used to form pixels, then full-color display is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The invention merges multiple light-emitting diode chips (red, green, and blue) into a single blue light-emitting diode chip combined with a wavelength conversion film. This consolidation reduces the number of separate components, simplifies the pixel structure, and lowers manufacturing complexity while maintaining full-color display capability through phosphor-based color generation.
Solution Approach 2:
The single blue light-emitting diode chip serves multiple functions: it provides the excitation source for the wavelength conversion film and enables full-color display through the phosphor conversion process. This multi-functional approach eliminates the need for separate red, green, and blue light-emitting diode chips, thereby reducing device complexity.
3Power
If traditional light-emitting diode structures are used, then light emission is achieved, but device thickness increases
Solution Approach 1:
The invention employs a thin film structure for the wavelength conversion film that directly covers the blue light-emitting diode chip. This thin film approach, combined with the chip-scale packaged light-emitting diode, significantly reduces the overall device thickness while maintaining effective light emission and wavelength conversion functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces overall device thickness, improves illumination uniformity, simplifies electrical control, and lowers production costs by using fewer materials and eliminating voltage differences between color units.
Implementation Method 1
the wavelength conversion film converts light emitted by the light-emitting diode chip into white light
Implementation Method 2
the color filter layer includes a plurality of color resists, each of the color resists is a red color resist, a green color resist or a blue color resist
Data Source
AI summary
A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.