Window Element for DMD Package Optical Performance
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Solution Overview
Problem
Conventional digital micro-mirror devices suffer from light scattering and reflection due to the unsmooth surface of the sealant and glass structure, which affects the quality of imaging in projectors.
Innovation Solution
A package structure with a chip module and a cover featuring a window element with a smooth surface, allowing signals to pass through without scattering or reflection, enhancing optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealant and glass structure are used to cover the chip, then the chip is protected and the package is sealed, but the light signal is scattered and reflected, degrading imaging quality
Solution Approach 1:
The cover is segmented into multiple functional layers: a lower cover layer for sealing and protection, and an upper window element layer for optical transmission. This segmentation allows each layer to specialize in its primary function without compromising the other.
Solution Approach 2:
Different regions of the cover have different optical properties. The window element region has high light transmittance and smooth surface for minimal scattering, while the sealant regions provide protection and sealing. This local differentiation resolves the contradiction between protection and optical quality.
2Illumination intensity
If a smooth window element is used for light transmission, then optical performance is improved, but the sealing and protection function is reduced
Solution Approach 1:
The patent merges the sealing function (performed by the sealant and lower cover) with the optical transmission function (performed by the window element) into a single integrated cover structure. This combination allows both protection and high-quality light transmission to coexist.
Solution Approach 2:
The window element acts as an intermediary between the external environment and the chip module. It provides a smooth, optically optimized interface for light transmission while the underlying sealant and cover structure provide the sealing and protection functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The smooth window element increases the utilization rate of the signal, improving the efficiency and quality of image projection by preventing signal loss through reflection or scattering.
Implementation Method 1
The first signal passes through the window element to contact with the chip module
Implementation Method 2
the light 150 is normally reflected or scattered when passing through the sealant 130 and the glass structure 160
Implementation Method 3
the light 150 is normally reflected or scattered when passing through the sealant 130 and the glass structure 160
Data Source
AI summary
A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.