Window-Form Photosensitive Assembly for Thin Camera Module Alignment
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Solution Overview
Problem
Conventional image capture modules face challenges in miniaturization due to the thickness and height of components, optical axis alignment issues, dust contamination, and poor heat dissipation, which hinder the development of thinner and lighter image capture modules with improved imaging quality.
Innovation Solution
A photosensitive assembly with a window-form circuit board and packaging body, where the photosensitive element and circuit board are integrally packaged in a spatially overlapping manner, reducing the relative height and allowing for adjustable thickness, and incorporating a lens portion for stable installation and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a color filter array (CFA) is used in the photosensitive component, then color image capture capability is improved, but manufacturing complexity and defect rates increase due to multiple lamination processes
Solution Approach 1:
The patent combines the color filter array (CFA) and microlens array into a single integrated color filter microlens array component. This merging eliminates the need for separate lamination processes, reducing manufacturing complexity while maintaining color image capture capability. The integrated structure allows both color filtering and light focusing functions to be achieved in one component layer.
Solution Approach 2:
The integrated color filter microlens array serves multiple functions simultaneously: it acts as both a color filter for spectral separation and a microlens for light focusing and concentration. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure and manufacturing process while enhancing the photosensitive component's versatility.
2Manufacturing precision
If multiple lamination processes are used to assemble CFA and microlens arrays, then alignment precision can be achieved, but production time and manufacturing costs increase
Solution Approach 1:
The color filter array and microlens array are pre-integrated into a single component structure during manufacturing. This preliminary integration eliminates the need for subsequent alignment and lamination processes, maintaining precise spatial relationships between color filters and microlenses while significantly reducing production time and manufacturing steps.
Solution Approach 2:
By merging the CFA and microlens array into one integrated component, the patent eliminates multiple lamination processes that would otherwise be required for alignment. The integrated structure ensures precise positioning of microlenses relative to color filters without requiring complex alignment procedures, thereby improving productivity.
3Reliability
If separate CFA and microlens arrays are assembled through lamination, then functional performance is maintained, but yield rates decrease due to higher defect rates
Solution Approach 1:
The patent integrates the color filter array and microlens array into a single component, eliminating the lamination process that introduces defects such as bubbles, delamination, and misalignment. This merging maintains the functional performance of both color filtering and light focusing while significantly reducing defect rates and improving yield rates.
Solution Approach 2:
The patent extracts and eliminates the problematic lamination process from the manufacturing sequence by integrating the CFA and microlens array into one component. This removal of the lamination step eliminates the associated defect sources, improving both yield rates and functional reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a more compact image capture module with improved optical axis alignment, reduced dust contamination, and enhanced heat dissipation, facilitating the development of thinner and lighter modules with superior imaging quality.
Implementation Method 1
a photoelectric conversion layer configured to convert the incident light into an electrical signal
Data Source
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AI summary
An photosensitive assembly (1010) and an image capture module and manufacturing methods thereof, wherein the photosensitive assembly (1010) comprises at least one photosensitive element (1011), at least one window-form circuit board (1012) and at least one packaging body (1013); wherein the photosensitive element (1011) and the window-form circuit board (1012) are integrally packaged by the packaging body (1013); the window-form circuit board (1012) comprises a circuit board main body and has at least one window (10122), and the photosensitive element (1011) is disposed in the window (10122).