Wiper Tape Cleaning Head for Photomask Adhesive Removal
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Solution Overview
Problem
The removal of adhesive residues from photomasks after a de-pellicle process is inefficient, leading to potential contamination and quality issues in semiconductor manufacturing, as existing methods lack precision and consistency.
Innovation Solution
A cleaning apparatus and method utilizing a wiper tape system with a cleaning head and suction device, where the wiper tape is guided continuously over the cleaning head and then collected, allowing for controlled movement and solvent application to remove adhesive residues, while a pressure sensor ensures optimal cleaning pressure and a suction device prevents re-contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual cleaning methods are used to remove adhesive residues from photomasks, then the cleaning process is simple to implement, but the cleaning efficiency and consistency are poor leading to potential contamination
Solution Approach 1:
The wiper tape system automatically removes adhesive residues through continuous contact with the photomask surface during normal operation, eliminating the need for separate manual cleaning operations. The system serves itself by integrating the cleaning function into the existing operational workflow, thereby improving productivity without proportionally increasing complexity.
Solution Approach 2:
The invention replaces manual mechanical cleaning with an automated wiper tape mechanism that uses controlled mechanical motion and solvent application. This substitution transitions from simple manual wiping to a more complex but efficient automated system that delivers consistent cleaning results and higher productivity.
2Manufacturing precision
If increased cleaning pressure is applied to remove adhesive residues, then the cleaning effectiveness improves, but the risk of damage to the photomask increases
Solution Approach 1:
The system optimizes cleaning parameters by controlling the wiper tape's contact pressure, speed, and solvent application rate. By adjusting these parameters within specific ranges, the system achieves high cleaning quality while maintaining pressure levels that prevent photomask damage, thus resolving the contradiction between cleaning effectiveness and damage risk.
Solution Approach 2:
A solvent is introduced as an intermediary substance between the wiper tape and the adhesive residue. The solvent chemically interacts with the adhesive to weaken its bonding, allowing the wiper tape to remove residues with reduced mechanical pressure, thereby improving cleaning quality without increasing damage risk.
3Reliability
If continuous wiper tape contact is used to clean the photomask, then the cleaning consistency improves, but the generation of contaminants during cleaning increases
Solution Approach 1:
The system extracts contaminants from the cleaning process by using a suction device that simultaneously removes debris, dust, and spent solvent generated during wiper tape contact with the photomask. This extraction function maintains cleaning consistency while preventing contaminant accumulation that could compromise photomask quality.
Solution Approach 2:
The wiper tape operates continuously with uninterrupted contact with the photomask surface, ensuring consistent cleaning across the entire surface area. This continuous action, combined with simultaneous contaminant removal, maintains high reliability without allowing contaminants to accumulate and cause harm.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient, consistent, and automated removal of adhesive residues, reducing manual labor, minimizing damage to the photomask, and ensuring high cleaning quality by controlling pressure and removing contaminants effectively.
Implementation Method 1
a suction device configured to suck contaminants generated during the cleaning operation away from the portion of the cleaning head
Implementation Method 2
a pressure sensor ensures optimal cleaning pressure
Data Source
AI summary
In a method of cleaning a photomask, a wiper tape is guided from a wiper tape supplying reel, over a cleaning head, and then onto a wiper tape collecting reel. A section of the wiper tape over the cleaning head is brought into contact with an adhesive residue on a surface of the photomask. A relative movement is caused between the photomask and the section of the wiper tape to remove the adhesive residue from the surface of the photomask.


