Wire Bonder Auto-Calibration Using Bonding Wire Deformation
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Solution Overview
Problem
Current wire bonder calibration methods are time-consuming, require additional equipment, and may not accurately simulate actual operation, leading to inconsistent performance due to limited measurement ranges and external device dependencies.
Innovation Solution
A wire bonder equipped with a processor, bond head, and measuring device that measures deformation of the bonding wire to derive correlations between operating parameters and desired deformations, allowing for auto-calibration based on predefined master curves, eliminating the need for external equipment and simulating actual bonding conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external laser vibrometer or optical vibrometer is used to measure ultrasonic vibration, then measurement capability is provided, but setup time increases and device complexity increases
Solution Approach 1:
The wire bonder uses its own built-in measuring device to measure the ultrasonic vibration of its transducer tip, eliminating the need for external measurement equipment. This self-service approach reduces setup time and device complexity while maintaining measurement capability.
Solution Approach 2:
The measuring device is integrated into the wire bonder system itself, merging the measurement function with the bonding function. This integration eliminates the need for separate external measurement equipment and reduces overall system complexity.
2Measurement precision
If external force sensor is used to calibrate bond force, then calibration capability is provided, but device complexity increases and calibration time increases
Solution Approach 1:
The wire bonder uses its own built-in measuring device to measure bonding results and perform force calibration, eliminating the need for external force sensors. This self-service approach reduces device complexity and calibration time.
Solution Approach 2:
The measuring device acts as an intermediary that provides measurement data for both vibration analysis and force calibration, eliminating the need for separate external force sensing equipment.
3Measurement precision
If bonding results are measured using external equipment, then measurement capability is provided, but calibration accuracy decreases due to limited measurement range
Solution Approach 1:
The measuring device is integrated into the wire bonder, allowing measurements to be taken within the actual operational context of the machine. This merging enables full-range measurement capabilities and improves calibration accuracy by simulating real operating conditions.
Solution Approach 2:
The measuring device is pre-integrated into the wire bonder system, allowing calibration measurements to be performed across the full operating range before actual production use, ensuring accurate calibration without limiting measurement ranges.
4Measurement precision
If conventional calibration method is used, then calibration process is provided, but productivity decreases due to long measurement and setup time
Solution Approach 1:
The wire bonder performs calibration measurements using its own integrated measuring device, eliminating the need for external equipment setup and reducing overall calibration time, thereby improving productivity.
Solution Approach 2:
The measuring device operates continuously within the wire bonder system, allowing calibration measurements to be performed without interrupting the workflow or requiring separate setup phases, thus maintaining continuous productive action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves calibration accuracy and efficiency by directly measuring bonding results within the wire bonder, reducing setup time and costs, and ensuring consistent performance across different machines.
Implementation Method 1
measuring device being operable to measure a deformation of a bonding portion of the bonding wire
Data Source
AI summary
Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed.