Wire Bonder Transducer Mounting for Multi-Axis Scrubbing

The patent applies the dynamics principle by replacing the static linear scrubbing motion with a dynamic multi-linear scrubbing motion. The flexural structure enables the bonding tool tip to move in multiple linear directions (X, Y, and Z axes) during the bonding process, creating a more effective cleaning action on the die pad surface while maintaining a relatively simple overall device structure.

The patent implements the dimensionality change principle by adding movement in multiple spatial dimensions. Instead of restricting the scrubbing motion to a single linear path, the flexural structure allows the bonding tool tip to scrub across the die pad surface in multiple linear directions, effectively utilizing X, Y, and Z axes to improve cleaning coverage and quality.

The patent applies the dynamics principle by enabling the transducer to operate at variable frequencies rather than a fixed frequency. The system can dynamically adjust the ultrasonic frequency and combine it with multi-linear mechanical motion to optimize bonding conditions, resulting in improved bond strength between the ball bond and die pad surface.

The patent implements the parameter changes principle by allowing variation in the ultrasonic frequency parameter during the bonding process. Instead of operating at a single fixed frequency, the system can change the frequency parameter to match different bonding requirements and material properties, thereby optimizing the bond strength while managing transducer operation complexity.