Wire Bonding Tool Guide for Retainer Alignment
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Solution Overview
Problem
The difficulty in replacing bonding tools in wire bonding apparatuses due to alignment issues between the bonding tool and the retainer, making it challenging to insert a new tool effectively.
Innovation Solution
A bonding apparatus with a bonding tool guide and manipulator system that aligns and directs the bonding tool into the retainer, utilizing a guiding aperture with a variable diameter and alignment mechanisms to accommodate misalignment and ensure correct positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding tool is made with precise dimensions for proper retention, then the retention reliability is improved, but the alignment difficulty during replacement increases
Solution Approach 1:
A guide structure is introduced as an intermediary component between the bonding tool holder and the bonding tool retainer. This guide structure includes a guide aperture that receives the bonding tool and guides it into proper alignment with the retention aperture, mediating the transfer process and eliminating direct alignment requirements between the holder and retainer.
Solution Approach 2:
The tool transfer system is segmented into distinct functional components: the bonding tool holder, the guide structure with guide aperture, and the bonding tool retainer with retention aperture. This segmentation allows each component to be optimized independently - the holder stores tools, the guide ensures proper alignment during transfer, and the retainer provides secure retention.
2Ease of operation
If the bonding tool dimensions are increased for easier handling, then the ease of operation is improved, but the device complexity increases
Solution Approach 1:
The guide structure serves as a mediator that accommodates bonding tools of various dimensions. The guide aperture is designed to receive the bonding tool regardless of its specific size, and the guide structure's geometry automatically adapts to guide the tool into correct alignment, reducing the need for complex adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and accurate replacement of bonding tools by aligning and guiding them into the retainer, reducing the complexity and time required for tool changes in wire bonding processes.
Implementation Method 1
an ultrasonic transducer mounted onto the bond head, the ultrasonic transducer comprising a piezoelectric driver stack coupled to a horn
Implementation Method 2
a bonding tool manipulator configured to transfer the bonding tool between the bonding tool holder and the bonding tool retainer
Data Source
AI summary
A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.