Conductive Knitted Wire Mesh for Semiconductor Chamber RF Connection
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face destruction due to repeated pressure differences between the bell jar and vacuum chamber, causing deformation and damage to the O ring seal and connected electrodes.
Innovation Solution
Incorporating a conductive knitted wire mesh that deforms to accommodate pressure changes, allowing the chamber to move without applying destructive loads on the bell jar and electrodes, and using a radio frequency power supply to generate plasma for processing semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid conductive member is used to connect the electrode to the radio frequency power supply, then electrical connection is stable, but the bell jar and electrode are destroyed due to repeated pressure difference loads
Solution Approach 1:
The patent applies this principle by using a flexible cable instead of a rigid conductive member to connect the electrode to the radio frequency power supply. The flexible cable can deform to accommodate chamber movement while maintaining electrical connection, thus preventing structural damage to the bell jar and electrode while ensuring stable electrical connectivity.
Solution Approach 2:
The patent applies this principle by transitioning from a static rigid conductive member to a dynamic flexible cable that can adapt its shape and position. The flexible cable dynamically responds to pressure changes and chamber movement, allowing the system to maintain both electrical connection stability and structural integrity under varying operational conditions.
2Reliability
If the chamber is sealed with an O ring to prevent leakage, then vacuum sealing is effective, but the O ring deforms and the bell jar moves due to pressure difference
Solution Approach 1:
The patent applies this principle by using an O ring seal that can deform elastically to accommodate pressure differences. The flexible O ring maintains the vacuum seal while allowing the bell jar to move slightly without compromising the sealing effectiveness or causing structural damage.
Solution Approach 2:
The patent applies this principle by designing the sealing system with compliant elements (O ring) that can absorb and cushion the effects of pressure differences before they cause damage. The O ring deforms in advance to accommodate pressure changes, preventing direct transmission of harmful forces to the bell jar structure.
3Productivity
If repeated vacuum cycles are performed for manufacturing, then production efficiency is improved, but the bell jar and electrode are damaged by repeated pressure difference loads
Solution Approach 1:
The patent applies this principle by using flexible connections (cable and O ring) that allow the system to dynamically adapt to repeated pressure cycles. These flexible elements enable rapid vacuum cycles for improved productivity while simultaneously protecting the structural integrity of the bell jar and electrode, thus maintaining apparatus durability.
Solution Approach 2:
The patent applies this principle by employing flexible components that can repeatedly deform and recover during vacuum cycles. The flexible cable and O ring seal can withstand repeated pressure differences without permanent damage, enabling high-productivity manufacturing while preserving apparatus reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to the semiconductor manufacturing apparatus by allowing the chamber to move with pressure changes, increasing the lifespan of the apparatus and reducing the time required for connecting the radio frequency power supply and impedance matching.
Implementation Method 1
The radio frequency power supply 118 supplies radio frequency power to the first electrode 106 via the conductive member 120 and then energizes the oxygen gas 121 to form plasma 122 in the bell jar 102
Implementation Method 2
The radio frequency power supply 118 supplies radio frequency power to the first electrode 106 via the conductive member 120 and then energizes the oxygen gas 121 to form plasma 122
Implementation Method 3
A vacuum pump (not shown) connected to the vacuum chamber 104 exhausts the vacuum chamber 104 and the bell jar 102
Implementation Method 4
when the vacuum pump exhausts the vacuum chamber and bell jar 102, pressure difference is generated between inside and outside of the bell jar 102
Implementation Method 5
the conductive knitted wire mesh deforms to accommodate a movement of the chamber when the pressure in the chamber is reduced
Data Source
AI summary
A semiconductor manufacturing apparatus includes a chamber, a gas supplier, a vacuum pump, an electrode, a conductive knitted wire mesh and a radio frequency power supply. The electrode is placed outside of the chamber and fixed to the chamber. The gas supplier supplies gas into the chamber. The vacuum pump exhausts the chamber. The radio frequency power supply supplies radio frequency power to the electrode through the conductive knitted wire mesh.