Wire Shielding Structure for Thin RF Module Isolation
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Solution Overview
Problem
Conventional communication terminals face challenges in integrating multiple frequency bands and modules while maintaining electromagnetic shielding without increasing manufacturing complexity and costs, particularly due to the need for thinner designs and reduced interference between components.
Innovation Solution
An electromagnetic shielding structure utilizing a module substrate with ground holes defining mounting areas, ground pads, and wires forming a shield layer over components, allowing for adjustable wire heights and connections without additional materials or processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding cover is added between different modules to isolate them, then electromagnetic interference between modules is reduced, but the device height increases and manufacturing complexity increases
Solution Approach 1:
The patent embeds the shielding function directly within the module substrate structure by creating ground holes and placing ground pads inside them, rather than adding a separate shielding cover on top. This nesting approach integrates the shielding function into the existing substrate, avoiding additional height while maintaining electromagnetic isolation between modules.
Solution Approach 2:
The patent transitions from a traditional planar shielding cover to a three-dimensional structure by creating ground holes that extend through the substrate thickness and positioning ground pads within these holes. This vertical arrangement in the Z-dimension provides effective shielding while maintaining a compact overall height.
2Object-affected harmful factors
If the height of the shielding cover is increased to reduce impacts on radio frequency performance, then shielding effectiveness is improved, but the device becomes thicker and more complex
Solution Approach 1:
The patent combines the shielding function with the module substrate structure itself by integrating ground holes and ground pads into the substrate. This merging eliminates the need for a separate shielding cover and its associated complex manufacturing processes, while still achieving effective radio frequency shielding.
Solution Approach 2:
The ground holes and ground pads serve multiple functions simultaneously: they provide electromagnetic shielding, establish ground connections for RF components, and integrate into the existing substrate architecture. This multi-functionality reduces overall device complexity while maintaining shielding effectiveness.
3Object-affected harmful factors
If holes are opened on the shielding cover to improve radio frequency performance, then signal transmission is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of opening holes in a shielding cover to allow signal passage, the patent inverts the approach by creating ground holes that are intentionally designed to provide both shielding and ground connections. The ground pads within these holes facilitate RF signal transmission while maintaining shielding integrity, eliminating the need for additional openings in a separate cover.
4Object-affected harmful factors
If additional electromagnetic shield layers and metal ion plating processes are added to achieve shielding in ultra-thin designs, then shielding effectiveness is maintained, but manufacturing difficulty and cost increase
Solution Approach 1:
The module substrate structure serves itself by providing both mechanical support and electromagnetic shielding functions through its own integrated ground holes and ground pads, eliminating the need for additional external shielding layers and complex metal ion plating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective shielding with reduced signal interference and manufacturing simplicity, enabling lighter and thinner designs suitable for ultra-thin communication terminals.
Implementation Method 1
a plurality of wires, where two ends of each wire are respectively connected to two different ground pads, to enable the plurality of wires to jointly form a shield layer arranged over the to-be-shielded component
Data Source
AI summary
Disclosed in the present invention are an electromagnetic shielding structure, a manufacturing method and a communication terminal. The electromagnetic shielding structure comprises a module substrate, which is formed with a plurality of grounding holes penetrating through the module substrate, and the plurality of grounding holes jointly define a mounting area; a device to be shielded, which is attached to the module substrate and located in the mounting area; a plurality of grounding bonding pads, which are respectively arranged in the grounding holes in a penetrating manner; and a plurality of wires, wherein the two ends of each wire are respectively connected to two different grounding bonding pads, such that the plurality of wires jointly form a shielding layer erected above the device to be shielded.