Wirebond-less Semiconductor Package Using Conductive Clip System
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Solution Overview
Problem
Conventional semiconductor packaging solutions face challenges with high electrical and thermal resistance, wirebond reliability issues, contamination, increased costs, and complexity, especially under extreme power conditions and high-frequency operations, which limit their effectiveness and scalability.
Innovation Solution
A wirebond-less packaging solution using a conductive clip system with electrically isolated sections that directly connect semiconductor electrodes to I/O contacts, eliminating the need for wirebonds and simplifying the packaging process, while allowing for easy adaptation to various die designs and configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonds are used to connect semiconductor pads to package I/Os, then electrical connections can be established, but parasitic resistance and inductance increase, reducing electrical isolation and performance
Solution Approach 1:
The patent removes wirebonds from the packaging system entirely, extracting the harmful element that causes parasitic resistance, inductance, and electrical isolation issues. The connection is achieved through a direct solder joint between the die pad and leadframe, eliminating the intermediate wirebond structure that introduces these harmful electrical characteristics.
Solution Approach 2:
The patent introduces solder as an intermediary material that directly bonds the die pad to the leadframe, replacing the wirebond intermediary. This solder joint provides a low-resistance, low-inductance electrical connection that maintains electrical isolation while establishing reliable electrical connectivity between the semiconductor device and package I/Os.
2Power
If multiple wirebonds are used to conduct high currents, then current carrying capacity increases, but cost and complexity increase
Solution Approach 1:
The patent removes the need for multiple wirebonds by using a single solder joint that directly connects the die pad to the leadframe. This extraction of the wirebonding process eliminates the complexity of managing multiple wires while maintaining the ability to conduct high currents through the robust solder connection and underlying metallization structures.
Solution Approach 2:
The patent merges the electrical connection function and mechanical attachment function into a single solder joint, eliminating the need for separate wirebonds. This consolidation reduces device complexity while maintaining current carrying capacity, as the solder joint provides both structural support and electrical connectivity in one integrated connection.
3Reliability
If wirebonds are used for impedance matching, then electrical connections are established, but repeatability becomes difficult to achieve
Solution Approach 1:
The patent removes wirebonds from the impedance matching circuit, eliminating the source of variability in wire profile, bond strength, and electrical characteristics. By using a direct solder joint connection, the impedance matching becomes more repeatable and controllable, as solder joints can be more precisely controlled and standardized in the manufacturing process compared to wirebonding.
4Reliability
If conventional packaging methods are used, then semiconductor devices are protected, but manufacturing cost and processing time increase due to cleaning requirements
Solution Approach 1:
The patent removes the wirebonding step from the manufacturing process, which eliminates the need for subsequent cleaning operations to remove flux and contaminants from wirebond surfaces. This extraction of the wirebonding process directly improves manufacturing efficiency and reduces processing time while maintaining device protection through the solder joint and encapsulation.
Data Source
AI summary
A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.