Wirebonded Triode Structure for Vacuum-Stable Signal Amplification
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing triode designs face challenges in maintaining vacuum integrity due to outgassing, particularly in thermionic emission systems, leading to reduced operational life and electron flow efficiency.
Innovation Solution
The use of wirebonded structures for the grid, emitter, and collector elements within a triode, formed through wirebonding techniques, which allows for unique shapes and enhanced electrical connectivity, and the incorporation of a getter material to prolong vacuum life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermionic emission systems are used in triodes, then electron flow capability is improved, but vacuum integrity deteriorates due to outgassing
Solution Approach 1:
The patent extracts and removes outgassing materials from the vacuum environment by incorporating getter materials that chemically bind with and trap the outgassed substances, preventing them from interfering with electron flow while maintaining the vacuum integrity necessary for thermionic emission operation
Solution Approach 2:
The getter material acts as an intermediary substance between the thermionic emission system and the vacuum environment, absorbing the harmful outgassing effects and protecting the electron flow path from contamination while allowing the thermionic emission process to continue uninterrupted
2Reliability
If conventional vacuum tube packaging is used, then vacuum sealing is achieved, but adaptability to different sockets deteriorates
Solution Approach 1:
The patent applies universal mounting structures and standardized connection interfaces that allow the triode to be adapted to multiple socket types and configurations, enabling the same vacuum tube design to function across different applications and hardware platforms while maintaining vacuum integrity
3Reliability
If wirebonded structures are used for grid, emitter and collector, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical wire bonding processes with alternative connection methods such as direct metal deposition, sintering, or integrated circuit board mounting techniques, achieving reliable electrical connectivity between grid, emitter, and collector while significantly simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances electron flow and amplification capabilities while maintaining a stable vacuum environment, improving the operational life and performance of triode devices.
Implementation Method 1
The triode allows for the amplification of low strength electromagnetic signals... The grid functions to control whether the emitted electrons can travel to the electron collector (anode)... Amplification derives from the quantity of electrons that pass through or by the grid
Implementation Method 2
Often a getter is present inside the cavity to scavenge adventitious materials and maintain a vacuum environment within the vacuum tube
Implementation Method 3
Thermionic emitters use heat to expel electrons from a source, usually a metal. The heat is created by applying an electrical current to the emitter metal
Implementation Method 4
The grid functions to control whether the emitted electrons can travel to the electron collector (anode). As voltage changes at the grid, more or fewer electrons are permitted to pass to the collector
Data Source
AI summary
A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.


