Wired Circuit Board Insulating Layer Thickness Transition

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Solution Overview

Problem

Conventional wired circuit boards face shape defects in the conductive layer due to thickness variations in the insulating layer, which affect both flexibleness and rigidity.

Innovation Solution

A wired circuit board design featuring an insulating layer with distinct thickness portions and a conductive layer with corresponding thickness variations, where the conductive portions are strategically positioned to avoid the border of the thickness-changing insulating portion, ensuring a smooth transition and preventing shape defects during manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the thickness of the wire pattern changes on the upper surface of the border portion in the insulating layer, then both excellent flexibleness and excellent rigidity can be achieved, but a shape defect of the wire pattern may occur

Engineering Contradiction:

Improveflexibleness and rigidityVSAvoidshape defect of wire pattern

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces a third insulating portion as an intermediary structure between the first and second insulating portions. This third portion has a thickness that gradually transitions from the first to the second insulating portion, creating a smooth border that prevents shape defects in the wire pattern while maintaining the desired flexibility and rigidity characteristics

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies parameter changes by varying the thickness of the insulating layer continuously from the first to the second insulating portion through the third insulating portion. This gradual parameter transition prevents abrupt changes that would cause wire pattern deformation, while still achieving the overall thickness variation needed for flexibility and rigidity control

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If the wire pattern has the same thickness in the extension direction, then manufacturing is simplified, but both further more excellent flexibleness and excellent rigidity cannot be achieved

Engineering Contradiction:

Improvewire pattern thickness consistencyVSAvoidflexibleness and rigidity

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by creating different thickness regions in the insulating layer (first, second, and third portions) while keeping the wire pattern thickness relatively uniform. This allows different mechanical properties (flexibility and rigidity) to be achieved in different areas without significantly complicating the wire pattern manufacturing process

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If a thick portion and thin portion are formed in the insulating layer, then both excellant flexibleness and excellant rigidity can be achieved, but a border portion with thickness transition creates potential shape defects

Engineering Contradiction:

Improveflexibleness and rigidityVSAvoidwire pattern shape stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The third insulating portion serves as a mediator between the thick first insulating portion and the thin second insulating portion. This intermediary structure provides a gradual thickness transition that eliminates abrupt borders, thereby preventing wire pattern shape defects while maintaining the flexibility and rigidity benefits of variable thickness design

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10021780B2Wired circuit board and producing method thereof

Publication Date: 2018.07.10 NITTO DENKO CORP

AI summary

A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.