Wireless IC Test Board Eliminates Mechanical Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional test boards require physical contact with IC devices to function, which limits their ability to test IC devices without external conductive elements and can damage devices due to clamping pressure.
Innovation Solution
The development of a test board with wirelessly enabled functional blocks that communicate with the IC device's wirelessly enabled functional blocks, eliminating the need for physical contact and reducing registration requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional test boards use physical contact with IC devices, then signal transmission is reliable, but IC devices without external conductive elements cannot be tested
Solution Approach 1:
The patent replaces the mechanical contact-based signal transmission system with a wireless communication system. The test board includes a wireless communication module that transmits test signals and receives response signals wirelessly, eliminating the need for physical contact with the IC device's conductive elements. This allows testing of IC devices without external conductive elements while maintaining signal transmission reliability through wireless communication protocols.
Solution Approach 2:
The patent introduces a wireless communication module as an intermediary between the test board and the IC device. This intermediary enables signal transmission without direct physical contact, allowing the test board to communicate with IC devices that lack external conductive elements by using wireless signals as the medium for interaction.
2Reliability
If conventional test boards use sockets with pins to contact IC devices, then IC devices can be tested, but the clamping pressure may damage the IC devices
Solution Approach 1:
The patent replaces the mechanical socket-and-pin contact system with a wireless communication system. Instead of using physical sockets that apply clamping pressure to establish contact, the test board uses a wireless communication module to transmit and receive signals wirelessly, completely eliminating the mechanical contact and associated clamping pressure that could damage IC devices.
Solution Approach 2:
The patent extracts the contact-making function from the testing system by removing the socket and pin structures entirely. The wireless communication module performs signal transmission without requiring physical contact elements, thereby eliminating the source of clamping pressure and potential device damage while preserving the essential testing capability.
3Reliability
If conventional test boards require precise registration between sockets and IC devices, then reliable contact is achieved, but the testing process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the precision mechanical registration system with a wireless communication system. The wireless communication module transmits signals wirelessly without requiring precise alignment or registration between the test board and IC device, thereby eliminating the complexity and time-consuming nature of precise registration while maintaining reliable signal transmission through wireless communication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the testing of IC devices without ohmic contact, reducing the risk of damage and allowing for more flexible test module designs, including platforms instead of sockets, thereby accommodating IC devices that communicate wirelessly.
Implementation Method 1
first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device
Data Source
AI summary
A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.


