Wireless LED Package Eutectic Bonding for Open Defects
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Solution Overview
Problem
LED packages face issues with open defects in wires and decreased luminescent efficiency due to wire placement, and the bonding process, such as soldering, is complex and yields poorly.
Innovation Solution
An LED package with first and second lead frames directly connected to the LED chip via eutectic bonding, eliminating the need for wires and simplifying the bonding process by using high-reflectivity and conductive materials like Au/Sn for electrodes and lead frames, and irradiating electromagnetic radiation for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to connect the LED chip to the exterior current supplying unit, then electrical connection is provided, but open defects occur on the wires and luminescent efficiency is decreased
Solution Approach 1:
The patent extracts and eliminates the wires from the LED package structure. By directly connecting the LED chip electrodes to the lead frames without intermediate wires, the harmful factors of open defects and luminescent efficiency loss are removed while maintaining electrical connection functionality
Solution Approach 2:
The patent merges the electrical connection function directly into the lead frame structure. The lead frames serve both as structural support and as direct electrical conduits to the LED chip electrodes, eliminating the need for separate wire connections
2Reliability
If a bonding process such as soldering is used to connect wires to the LED chip, then electrical connection is achieved, but the bonding process becomes complicated and processing yield decreases
Solution Approach 1:
The patent extracts and eliminates the complex bonding process from the manufacturing workflow. By designing the lead frames to directly contact the LED chip electrodes during mounting, the need for separate wire bonding or soldering processes is removed, simplifying the overall manufacturing process
Solution Approach 2:
The patent incorporates the electrical connection function into the preliminary lead frame structure before the bonding/mounting process. The lead frames are pre-configured with contact surfaces that directly engage with the LED chip electrodes, so the connection is established automatically during chip mounting rather than requiring a separate bonding step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents open defects, enhances luminescent efficiency, and improves processing yield by eliminating the need for wire bonding and using high-heat materials for reliable connections.
Implementation Method 1
irradiating electromagnetic radiation onto the contact portion between the first electrode and the first lead frame as well as the second electrode and the second lead frame to generate eutectic bonding
Data Source
AI summary
A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.