Wireless LO Signal Transmission Between Semiconductor Packages
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Solution Overview
Problem
High frequency signals face significant transmission challenges through wired connections due to high losses and restrictive length and routing limitations, necessitating a flexible and low-effort chip-to-chip communication solution.
Innovation Solution
A wireless communication system comprising semiconductor modules with integrated antenna structures within a common package, enabling flexible and efficient transmission of wireless communication signals between semiconductor modules, including the use of radar systems for determining object position information by transmitting and receiving phase information of local oscillator signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If wired connections are used for signal transmission, then connection stability is maintained, but signal loss increases and routing flexibility is restricted at high frequencies
Solution Approach 1:
The patent replaces wired mechanical connections with wireless electromagnetic field-based communication. The transmitter module generates electromagnetic signals that are transmitted through the air interface to the receiver module, eliminating the need for physical wired connections and their associated high-frequency signal losses and routing restrictions.
Solution Approach 2:
The patent introduces an antenna structure as an intermediary component between the transmitter module and the external environment. The antenna converts electrical signals from the transmitter into electromagnetic waves for wireless transmission, and also receives electromagnetic waves and converts them back to electrical signals for the receiver, enabling flexible wireless communication without direct wired connections.
2Adaptability or versatility
If wireless communication is implemented between semiconductor modules, then routing flexibility and adaptability are improved, but additional hardware components are required
Solution Approach 1:
The patent merges the antenna structure with the semiconductor module package, integrating the wireless communication functionality directly into the module housing. This combination reduces the need for separate external antenna components and simplifies the overall hardware architecture while maintaining routing flexibility and adaptability.
Solution Approach 2:
The antenna structure serves multiple functions: it acts as both the transmitting element for the transmitter module and the receiving element for the receiver module. This multi-functional design reduces the total number of hardware components needed while enabling flexible wireless communication between semiconductor modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for flexible and efficient high-frequency signal transmission with reduced hardware effort and space consumption, overcoming limitations of wired connections by enabling arbitrary module arrangement and avoiding signal power losses, while enabling accurate determination of object positions in radar systems.
Implementation Method 1
a transmitter module (118) configured to transmit the wireless communication signal through an antenna structure (114)
Implementation Method 2
a receiver module (128) configured to receive the wireless communication signal through an antenna structure (124) from the first semiconductor module (110)
Data Source
AI summary
A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.