Wiring Circuit Board Adhesion Layer for Low-Resistance Bonding
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Solution Overview
Problem
The adhesion of the first conductive layer to the metal supporting layer in existing wiring circuit boards is insufficient, leading to potential connectivity issues.
Innovation Solution
Incorporating an adhesion layer containing Zr, Ti, W, Mo, V, Y, or Nb on the metal supporting layer, with a content ratio of 0.8% or less, to enhance the adhesion of the first conductive layer, and adding a second adhesion layer to improve the connection between the first and second conductive layers through a penetrating hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a first conductive layer is directly disposed on a metal supporting layer, then the structure is simple, but the adhesion between the first conductive layer and the metal supporting layer is insufficient
Solution Approach 1:
An adhesion layer containing at least one metal selected from the group consisting of Zr, Ti, W, Mo, V, Y, Nb, and Ta is introduced as an intermediary between the first conductive layer and the metal supporting layer. This adhesion layer specifically improves the adhesion of the first conductive layer to the metal supporting layer, resolving the bonding issue while adding a functional layer to the structure.
2Strength
If the content ratio of metal in the adhesion layer is increased, then the adhesion is improved, but the resistance of the interface between the adhesion layer and the metal supporting layer increases
Solution Approach 1:
The content ratio of the metal in the adhesion layer is controlled to be 0.8% or less. This parameter optimization secures the adhesion of the adhesion layer to the metal supporting layer while suppressing the increase in resistance at the interfaces between the adhesion layer and both the metal supporting layer and the first conductive layer.
3Strength
If a second adhesion layer is added between the first and second conductive layers, then the adhesion is improved, but the structure becomes more complex
Solution Approach 1:
A second adhesion layer containing the metal is introduced between the first conductive layer and the second conductive layer to improve adhesion. This additional layer specifically enhances the connection between conductive layers while maintaining electrical connectivity through the penetrating hole structure.
Data Source
AI summary
A wiring circuit board includes a metal supporting layer, an adhesion layer, a first conductive layer, an insulating layer, and a second conductive layer. The adhesion layer is disposed on one-side surface of the metal supporting layer in the thickness direction, and contains at least one metal selected from the group Zr, Ti, W, Mo, V, Y, Nb, and Ta. The first conductive layer is disposed on one-side surface of the adhesion layer in the thickness direction, and has an insulating layer with a penetrating hole disposed on a one-side surface thereof. The second conductive layer includes a portion electrically connected with the metal supporting layer through the adhesion layer located in the penetrating hole. The second conductive layer is located at one side of the metal supporting layer in the penetrating hole and one side of the insulating layer in the thickness direction.