Wiring Board Inner-Hole Conductive Layer Peeling Prevention
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Solution Overview
Problem
Conventional methods for manufacturing wiring boards often result in the peeling of the inner-hole conductive layer during the cutting process, leading to defective products and reduced productivity due to the mechanical stress exerted by rotary tools on the inner-hole conductive layer.
Innovation Solution
A method involving a large-size wiring board with penetrating holes on the border of effective and dummy regions, where a second rotary tool with a drilling blade drills along the rotation axis to segment the inner-hole conductive layer, and a first rotary tool with a side blade cuts the dummy region, minimizing peeling by positioning the cutting blade outside the border line and using solder-resist layers to integrate the conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rotary tool with a cutting blade is used to cut off the dummy region from the large-size wiring board, then the wiring board can be manufactured, but the inner-hole conductive layer peels off due to mechanical stress
Solution Approach 1:
The patent segments the inner-hole conductive layer by drilling holes at peripheral portions of penetrating holes before cutting the dummy region. This segmentation divides the continuous conductive layer into separate sections, reducing the mechanical stress transmitted during cutting and preventing peeling.
Solution Approach 2:
The patent performs preliminary drilling of holes at the peripheral portions of penetrating holes before the cutting process. This preliminary action creates segmentation points in the inner-hole conductive layer in advance, so that when the dummy region is subsequently cut, the conductive layer is already divided and less susceptible to peeling forces.
2Reliability
If the inner-hole conductive layer is segmented by drilling holes, then peeling is suppressed, but the manufacturing process becomes more complex
Solution Approach 1:
The patent uses the same rotary tool for both drilling the segmentation holes and cutting the dummy region. This multi-functional approach eliminates the need for separate specialized equipment, reducing overall device complexity while still achieving the beneficial segmentation effect.
Solution Approach 2:
The patent combines the segmentation function and cutting function into a single integrated manufacturing process flow. The holes are drilled as part of the same setup and process that performs the cutting, merging two operations into one coordinated sequence rather than requiring separate independent processes.
3Reliability
If the rotary tool drills holes at peripheral portions of penetrating holes, then the inner-hole conductive layer is segmented and peeling is reduced, but additional processing time is required
Solution Approach 1:
The patent maintains continuous useful action by using the same rotary tool setup for both drilling the segmentation holes and cutting the dummy region. The tool remains in position and the process flow continues without interruption, eliminating setup time and maintaining high productivity despite the additional drilling step.
Solution Approach 2:
The patent merges the segmentation drilling operation with the cutting operation into a single coordinated process using the same rotary tool. This combination allows both operations to be performed in one setup without the overhead of separate tool changes or repositioning, minimizing the impact on manufacturing speed.
Data Source
AI summary
A method for manufacturing a wiring board includes preparing a large-sized wiring board having an effective region and a dummy region such that the board has a penetrating hole on a border of the effective and dummy regions and an inner-hole conductive layer covering an inner surface of the penetrating hole, moving a rotary tool having a tip blade along rotation axis at a peripheral portion of the penetrating hole such that the rotary tool drills a hole into the board at the peripheral portion and segments the conductive layer into portions in the effective and dummy regions, and moving a rotary tool having a side blade in a direction perpendicular to rotation axis such that the dummy region is cut off from the effective region after the rotary tool having tip blade makes the hole and a wiring board having the effective region of the board is formed.