Wiring Board Manufacturing Using Dual-Roughness Support Plate
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Solution Overview
Problem
In the manufacturing of thin and small-sized wiring boards using the build-up method, the challenge lies in achieving strong adhesion between the support plate and the resin layer while maintaining surface roughness differences to prevent warpage and ensure alignment precision, as roughening the support plate transfers surface roughness to the wiring board, making alignment marks difficult to recognize.
Innovation Solution
A method involving a support plate with distinct surface roughness areas, where one area is non-rough for the alignment mark and another is rough for the resin layer, ensuring improved adhesion and visibility of the alignment mark, allowing for thinning of the wiring board and enhanced alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the support plate is roughened to improve adhesion between the support plate and the resin layer, then adhesion is improved, but the surface roughness is transferred to the alignment mark, making it difficult to recognize
Solution Approach 1:
The support plate is divided into two distinct surface regions: a first surface with high roughness for strong adhesion with the resin layer, and a second surface with low roughness for clear alignment mark recognition. This local differentiation allows each surface to fulfill its specific function without compromising the other.
Solution Approach 2:
The support plate surface is segmented into functionally distinct areas: one area roughened for adhesion purposes and another area kept smooth for alignment purposes. This segmentation resolves the contradiction by separating the conflicting requirements of adhesion strength and alignment visibility into different spatial zones.
2Length of stationary object
If the core board is made thinner to reduce wiring board thickness, then wiring board thinning is achieved, but the core board cannot sufficiently support the soft build-up layer or prevent warpage
Solution Approach 1:
A support plate is introduced as an intermediary component during the manufacturing process to provide the necessary mechanical support and prevent warpage. This intermediary structure enables the use of thinner core boards while maintaining stability during build-up layer formation, after which the support plate is removed.
Solution Approach 2:
The support plate is placed in advance before forming the build-up layer to provide preliminary support and prevent warpage during the curing process. This preliminary action allows the use of thinner core boards that would otherwise be insufficient for supporting the soft, uncured build-up layer.
3Length of stationary object
If the support plate is removed after forming the wiring board to achieve thinning, then wiring board thinning is achieved, but adhesion between the support plate and resin layer must be sufficiently strong during the process
Solution Approach 1:
The support plate surface is differentiated into regions with different roughness characteristics: one region with high roughness that provides strong adhesion to the resin layer during manufacturing, and another region with low roughness that maintains smooth surfaces for alignment marks. This local quality differentiation enables both strong adhesion and subsequent removal.
Solution Approach 2:
The surface roughness parameter of the support plate is changed spatially to create areas of high and low roughness. This parameter change allows the support plate to provide strong adhesion where needed while maintaining smooth surfaces for alignment, enabling both strong bonding during manufacturing and clean removal afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful thinning of wiring boards with improved alignment precision by maintaining surface roughness differences on the support plate, preventing resin peeling and ensuring accurate recognition of alignment marks, thus enhancing manufacturing reliability.
Implementation Method 1
since adhesion is not strong between the support plate made of metal and the build-up layer made of resin, a countermeasure is needed to improve adhesion. As an example thereof, a method of improving adhesion to resin by roughening a metal surface has been studied.
Implementation Method 2
a method of improving adhesion to resin by roughening a metal surface has been studied
Data Source
AI summary
In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii).