Wiring Circuit Board Edge Layout for Crack-Resistant Mounting
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Solution Overview
Problem
Wiring circuit boards experience stress concentration and potential cracking at the ends of wiring portions due to curvature when electronic components are fixed in specific configurations, leading to potential damage.
Innovation Solution
The wiring circuit board design includes support portions and conductive patterns with specific edge and width configurations to disperse stress, featuring wider widths and thinner thicknesses in critical areas to reduce bending moments and crack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring circuit board is fixed to electronic components at both ends, then the wiring circuit board can be securely mounted, but stress concentration occurs at the wiring portion ends causing potential cracks
Solution Approach 1:
The patent applies local quality by making the first portion of the conductive pattern wider than the main body portion. This localized structural change increases the cross-sectional area at the stress-prone connection region, thereby dispersing stress concentration and preventing cracks while maintaining secure mounting at both ends.
Solution Approach 2:
The patent changes the geometric parameter of the conductive pattern by increasing the width of the first portion compared to the main body portion. This parameter modification allows the wiring portion to better withstand stress during mounting and operation, resolving the contradiction between secure mounting and stress resistance.
2Ease of manufacture
If the conductive pattern has uniform width throughout, then the manufacturing process is simpler, but stress concentrates at the end portions near the support
Solution Approach 1:
The patent implements local quality by varying the width of the conductive pattern - the first portion has a greater width than the main body portion. This localized differentiation addresses stress concentration at the ends while maintaining relatively simple manufacturing processes through standard PCB design and fabrication techniques.
3Strength
If the wiring portion is made thicker to increase strength, then crack resistance improves, but the bending moment increases causing more stress concentration
Solution Approach 1:
The patent applies local quality by increasing the width (not thickness) of the first portion of the conductive pattern. This localized dimensional change strengthens the connection area to resist cracks while avoiding an overall increase in the wiring portion thickness that would amplify bending moments and stress concentration.
Data Source
AI summary
A wiring circuit board includes a wiring portion, and a first support portion supporting one end portion of the wiring portion. A metal support layer of the wiring portion has a first end edge of a one-side end edge and a second end edge of another side end edge. A conductive pattern of the wiring portion has a main body portion disposed away from the first support portion and a first portion disposed between the first support portion and the main body portion. The main body portion has a third end edge of the one-side end edge and a fourth end edge of the other-side end edge. The first portion has a fifth end edge of the one-side end edge and a sixth end edge of the other-side end edge. The fifth end edge is disposed between the third end edge and the first end edge.