Wiring Board with Nested Substrates for Impact Tolerance
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Solution Overview
Problem
Existing wiring boards face challenges in combining substrates of different sizes while maintaining rigidity and flexibility to absorb impacts without compromising electrical connectivity.
Innovation Solution
A wiring board design featuring a base substrate sandwiched between two substrates of varying sizes, with interstitial via holes and vias, and an interlayer groove filled with elastic material to enhance shock absorption and prevent warping, allowing for the integration of both rigid and flexible sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates of different sizes are combined to provide both rigidity and flexibility, then impact tolerance is improved, but structural complexity increases
Solution Approach 1:
The wiring board is divided into a first substrate and a second substrate with different sizes and functions. The first substrate provides rigidity while the second substrate provides flexibility, allowing the board to absorb impacts effectively. This segmentation resolves the contradiction by creating specialized zones that collectively improve impact tolerance without requiring the entire structure to be complex.
Solution Approach 2:
The smaller second substrate is positioned on top of the larger first substrate, with the base substrate laminated between them. This nested arrangement allows both substrates to be integrated into a compact structure where the second substrate is supported by the first, reducing overall structural complexity while maintaining the benefits of having different sized regions.
2Reliability
If substrates of different sizes are combined to absorb impacts, then shock absorption is improved, but manufacturing complexity increases
Solution Approach 1:
The base substrate is prepared in advance and laminated between the first and second substrates before final assembly. The via holes are also formed preliminarily in the base substrate. This preliminary preparation simplifies the manufacturing process by establishing the structural framework before integrating the different-sized substrates, reducing overall manufacturing complexity.
Solution Approach 2:
The base substrate serves as an intermediary element that facilitates the connection between the first and second substrates. It provides a standardized interface with pre-formed via holes that align with corresponding vias in both substrates, simplifying the lamination and alignment processes during manufacturing.
3Reliability
If via holes are formed to connect substrates of different sizes, then electrical connectivity is maintained, but risk of connection rupture increases
Solution Approach 1:
The base substrate is positioned between the first and second substrates to provide mechanical support and cushioning for the via holes. This intermediate layer absorbs and distributes mechanical stresses, protecting the electrical connections from rupture during impacts while maintaining electrical connectivity between the different-sized substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved impact tolerance and reduced risk of electrical connection rupture by distributing impact energy and maintaining structural integrity, while allowing for compact and reliable mounting of electronic components.
Implementation Method 1
an interlayer groove filled with elastic material to enhance shock absorption
Data Source
AI summary
A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate.