Wiring Board Opening Layout for RF Impedance and Insulation
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Solution Overview
Problem
Conventional wiring boards face issues with impedance decrease and electrical short circuits due to high dielectric constants and conductor layer proximity, especially in radio-frequency signal transmission, and size reduction.
Innovation Solution
The wiring board design includes strategically positioned openings and conductors with symmetrically arranged pin terminals, using dielectric materials and conductive layers to maintain impedance and prevent short circuits, allowing for effective radio-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the dielectric constant is increased to improve signal transmission, then the signal transmission capability is improved, but the impedance decreases and signal loss increases
Solution Approach 1:
The patent applies local quality by creating openings with different sizes at different positions around the conductor. The first opening has a first size and the second opening has a second size different from the first size. This non-uniform opening configuration allows different regions to have different dielectric properties, thereby maintaining impedance while managing signal loss locally around the conductor structure.
Solution Approach 2:
The patent changes the dielectric parameter distribution by creating openings of varying sizes rather than using a uniform structure. By adjusting the size parameters of openings at different positions, the effective dielectric constant is optimized to maintain impedance stability while allowing signal transmission, resolving the contradiction between signal loss and impedance stability.
2Volume of moving object
If conductor layers are positioned closer together to reduce size, then the device size is reduced, but electrical short circuits occur between conductors
Solution Approach 1:
The patent introduces openings as intermediary structures between adjacent conductors. These openings, filled with air or low-dielectric material, act as insulating barriers that prevent electrical short circuits while allowing the conductors to be positioned closer together. The openings serve as a mediator that maintains electrical insulation in the reduced-size configuration.
Solution Approach 2:
The patent segments the dielectric material by creating openings that divide the continuous dielectric structure. This segmentation isolates adjacent conductors electrically while maintaining their proximity, allowing size reduction without compromising insulation reliability.
3Reliability
If openings are made larger to maintain impedance, then impedance is maintained, but the structural integrity and spacing between conductors is compromised
Solution Approach 1:
The patent applies local quality by assigning different sizes to openings at different positions. The first opening has a first size optimized for impedance control near the first conductor, while the second opening has a second size that maintains structural integrity near the second conductor. This localized optimization allows impedance control without compromising overall structural strength.
Solution Approach 2:
The patent uses asymmetric opening sizes rather than uniform openings. The first opening and second opening have different sizes tailored to their respective positions and functional requirements. This asymmetric configuration allows the structure to optimize both impedance control and structural integrity at different locations simultaneously.
Data Source
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AI summary
A wiring board includes a substrate, a conductor portion, and a terminal portion. The substrate includes a first surface and a first opening. The conductor portion includes a first conductor and a second conductor, and is positioned on the first surface. The terminal portion includes a first pin terminal and a second pin terminal. The second conductor is positioned to be spaced apart from the first conductor in a first direction. The first pin terminal is connected to the first conductor and extends upward. The second pin terminal is connected to the second conductor and extends upward. The first opening is positioned to be spaced apart from the first conductor, the second conductor, and a first imaginary line in a second direction perpendicular to the first direction. The first opening is positioned on a second imaginary line.