Wiring Circuit Board Assembly Sheet for Plating Thickness Uniformity
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Solution Overview
Problem
Conventional wiring circuit board production methods result in thickness variations of wirings due to localized concentration differences, particularly affecting outermost wirings, which is problematic for achieving precise thicknesses required for different kinds of wirings.
Innovation Solution
A wiring circuit board assembly sheet with a substrate having product and frame regions, where first and second wirings with different thicknesses are formed concurrently with corresponding dummy wirings in separate steps, using a dummy wiring pattern to equalize conductive material distribution and suppress thickness variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wiring pattern is formed in a single plating step, then the production process is simple and efficient, but thickness variations occur between outermost wiring and inner wiring
Solution Approach 1:
The single plating step is segmented into multiple plating steps (first plating step and second plating step). Each step forms a specific layer of wirings with controlled thickness, preventing the concentration variation problem that occurs when all wirings are formed simultaneously. This segmentation allows precise control of thickness for both outermost and inner wirings.
Solution Approach 2:
Dummy wirings are formed in advance in the frame region before the actual wiring pattern formation. These dummy wirings pre-consume conductive material and create a more uniform concentration distribution in the plating solution, thereby preventing thickness variations in the subsequently formed wirings.
2Adaptability or versatility
If multiple kinds of wirings with different thicknesses are required, then the wiring pattern functionality is enhanced, but suppressing thickness variation for each wiring type becomes more difficult
Solution Approach 1:
The formation of multiple wiring types with different thicknesses is achieved through segmented plating steps. The first plating step forms thinner wirings (first wiring) with controlled thickness, while the second plating step forms thicker wirings (second wiring) on top. Each step uses dummy wirings specific to that layer, ensuring uniform thickness control for each wiring type independently.
Solution Approach 2:
Different regions of the substrate are assigned different wiring patterns with specific thickness requirements. The dummy wiring configuration is locally optimized for each region - for example, regions requiring thinner wirings have different dummy wiring arrangements compared to regions requiring thicker wirings, allowing precise local thickness control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses thickness variations of wirings with different thicknesses by controlling conductive material deposition, ensuring uniformity and precision in wiring patterns.
Implementation Method 1
a wiring pattern is formed with a predetermined design thickness by a method, such as an additive method or a semi-additive method, including a step of depositing a conductive material for wiring pattern formation by a plating method
Implementation Method 2
in a plating solution to be used, the concentration of a conductive material near the outermost wiring is locally increased, and the outermost wiring has a greater deposition amount of the conductive material than the inner wiring
Data Source
AI summary
An assembly sheet as a wiring circuit board assembly sheet includes a substrate, a wiring pattern, and a dummy wiring pattern. The substrate includes a product region and a frame region adjacent to the product region. The wiring pattern is located on one side in a thickness direction of the substrate in the product region, and includes a first wiring and a second wiring thicker than the first wiring. The dummy wiring pattern is located on the one side in the thickness direction in the frame region, and includes a first dummy wiring and a second dummy wiring thicker than the first dummy wiring.