Wiring-Buried Glass Substrate with T-Shaped Through-Wiring
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Solution Overview
Problem
Conventional wiring-buried glass substrates limit the direction in which electrical extraction can be performed, restricting the orientation of sensor elements and thus the direction in which sensors using these substrates can be disposed.
Innovation Solution
The design includes a wiring-buried glass substrate with a T-shaped through-wiring configuration, where the pillar and beam portions are inclined, allowing for easier extraction of electric signals from both sides and improving adhesion and robustness, enabling the substrate to be disposed in various orientations without defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wiring-buried glass substrates are used with vertical wiring extraction, then the substrate structure is simple, but the sensor element orientation is restricted and cannot be disposed in various directions
Solution Approach 1:
The patent transitions from single-direction (vertical) wiring extraction to multi-directional extraction by adding beam portions that extend in directions perpendicular to the substrate surface. This dimensional expansion allows electrical signals to be extracted from both the top and bottom surfaces of the glass substrate, enabling sensor elements to be disposed in various orientations without being constrained to a single vertical extraction path.
Solution Approach 2:
The wiring structure is divided into distinct functional segments: a pillar portion that provides vertical support and electrical connection through the substrate thickness, and beam portions that extend horizontally to provide additional extraction paths. This segmentation allows each portion to serve specific functions - the pillar for structural integrity and primary vertical connection, while the beams enable lateral signal extraction and multi-orientation capability.
2Adaptability or versatility
If the wiring structure is made more complex to enable multi-directional extraction, then sensor placement freedom increases, but manufacturing difficulty and alignment errors increase
Solution Approach 1:
The patent merges the pillar portion and beam portions into a single integrated wiring structure formed through coordinated etching and filling processes. This unified structure eliminates the need for separate assembly steps that would introduce alignment errors, as the pillar and beams are formed as one continuous conductive path within the glass substrate, maintaining manufacturing precision while achieving multi-directional extraction capability.
3Ease of manufacture
If the wiring structure is simplified for easy manufacture, then production is easier, but the sensor element orientation is restricted
Solution Approach 1:
The wiring structure is designed to perform multiple functions simultaneously: the pillar portion provides vertical electrical extraction and structural support, while the beam portions enable horizontal signal extraction and accommodate various sensor orientations. This multi-functional design allows a single wiring configuration to serve both simple vertical extraction needs and complex multi-directional requirements, making the substrate universally applicable to different sensor element orientations without requiring separate specialized structures for each case.
Data Source
AI summary
A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.