Wiring Circuit Board Assembly Sheet Transport Method
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Solution Overview
Problem
The existing method for producing wiring circuit boards is complex and has low transportability due to the need for individual handling of separated boards, which complicates the process and increases the risk of damage to the supporting sheets.
Innovation Solution
A method involving overlapping an assembly sheet with a supporting sheet, cutting the joint to separate the wiring circuit boards from the supporting portion, and conveying the boards while supported by the sheet, which includes opening portions to reduce contact and damage, and using a resin sheet for improved handling and transportability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wiring circuit boards are separated one by one from the supporting portion, then the separation is complete, but the process becomes complicated and transportability decreases
Solution Approach 1:
The patent merges multiple separated wiring circuit boards into a single assembled unit that remains attached to the supporting portion. Instead of handling boards individually, the entire assembly is conveyed together as one unit, simplifying the transport process while maintaining complete separation of individual boards from the supporting portion structure.
Solution Approach 2:
The patent segments the supporting portion into discrete sections with cutting lines, allowing each wiring circuit board to be independently separable while maintaining the integrity of the overall assembly during transport. The supporting portion is divided into multiple support sections that can be independently accessed.
2Manufacturing precision
If wiring circuit boards are separated one by one, then separation is achieved, but transportability becomes poor
Solution Approach 1:
The patent combines multiple wiring circuit boards into a single integrated assembly that is conveyed together. The boards remain separated from the supporting portion but are maintained in their relative positions through the assembly structure, enabling easy transport as a single unit rather than individual boards.
Solution Approach 2:
The patent introduces an intermediary assembly structure that holds the wiring circuit boards in their separated state while enabling unified transport. This intermediate assembly acts as a mediator between the separated boards and the supporting portion, allowing easy handling and transport.
3Ease of manufacture
If the supporting sheet is damaged during cutting, then the joint can be cut, but foreign matter (dust) is generated and the sheet cannot be reused
Solution Approach 1:
The patent extracts the joint cutting function from the supporting sheet material itself. The joint is designed as a separate structural element that can be cut without damaging the supporting sheet material. The cutting action is applied to the joint structure rather than the supporting sheet, preventing dust generation and material degradation.
Solution Approach 2:
The patent segments the joint structure from the supporting sheet material, allowing the joint to be cut independently without affecting the integrity of the supporting sheet. The joint is designed as a separate component with defined cutting lines, enabling removal without damaging the supporting sheet surface.
4Ease of manufacture
If the supporting sheet is damaged, then cutting is possible, but the sheet cannot be reused
Solution Approach 1:
The patent extracts the cutting function from the supporting sheet material. The joint is designed as a separate structural element that can be removed through cutting without compromising the supporting sheet. The supporting sheet maintains its integrity and can be reused for subsequent production cycles.
Solution Approach 2:
The patent applies the discarding and recovering principle by designing the joint as a disposable element that can be cut and removed, while the supporting sheet is recovered and reused. The joint is intended to be discarded after use, while the supporting sheet continues to serve its supporting function in subsequent production cycles.
Data Source
AI summary
Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.