Wiring Member Fixing Structure Using Induction-Heated Joint Layers
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Solution Overview
Problem
Existing methods for attaching wire harnesses to molded ceilings using double-sided adhesive tapes face issues with dust adherence reducing tacky adhesion, requiring releasing papers or immediate attachment, which complicates the assembly process.
Innovation Solution
A fixing structure for wiring members incorporating a joint member with an adhesive layer, a heat generation layer capable of induction heating, and a joint layer that forms bonds when heated, allowing for simple fixation without the need for releasing papers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a double-sided adhesive tape is attached to a molded ceiling, then the wiring member can be fixed to the adherend, but dust adheres to the adhesive tape and tacky adhesion decreases
Solution Approach 1:
The adhesive system is segmented into two distinct functional layers: a first adhesive layer for initial attachment that remains covered, and a second adhesive layer exposed only when needed. This segmentation prevents dust contamination of the primary bonding surface while maintaining fixation capability.
Solution Approach 2:
The first adhesive layer is applied and cured in advance to create a stable base layer, while the second adhesive layer is kept protected until the moment of actual bonding. This preliminary action ensures the primary adhesive surface is ready but not yet exposed to contaminants.
2Reliability
If a releasing paper is provided on the double-sided adhesive tape to prevent dust adherence, then tacky adhesion is maintained, but a process of removing the releasing paper is necessary
Solution Approach 1:
The releasing paper function is extracted and replaced by a protective first adhesive layer that is integrated into the adhesive structure itself. This eliminates the need for a separate removing step while maintaining the protective function.
Solution Approach 2:
The protective function and adhesive function are merged into a single first adhesive layer that serves both purposes: protecting the bonding surface from dust and providing initial attachment capability.
3Reliability
If the double-sided adhesive tape is provided on the molded ceiling and the wire harness is immediately attached, then tacky adhesion is maintained, but this causes a limitation in the assembly process
Solution Approach 1:
The adhesive system transitions from a static exposed state to a controlled dynamic system where the second adhesive layer is exposed only when needed through relative movement between the wiring member and adherend. This enables flexible assembly timing while maintaining adhesion reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables straightforward and reliable fixation of wiring members to adherends, reducing assembly complexity and eliminating the need for releasing papers, while allowing for optional heat activation for bonding.
Implementation Method 1
the heat generation layer is a layer which can generate heat by induction heating
Data Source
AI summary
A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.