Wiring Substrate Cavity Gap Design for Insulating Layer Uniformity
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Solution Overview
Problem
The existing wiring substrates face reliability issues due to non-uniform thickness of the second insulating layer, which affects the depth and bottom area of via holes, leading to inconsistent connections between the wiring pattern and the electronic component's pad.
Innovation Solution
A wiring substrate design where the gap between the electronic component's side surface and the cavity's inner wall is tailored based on the volume distribution of recesses on the electronic component, ensuring uniform thickness of the insulating layer and consistent via hole dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second insulating layer is formed to cover the electronic component, then the electronic component is protected and insulated, but the thickness of the second insulating layer becomes non-uniform due to recesses on the electronic component surface
Solution Approach 1:
The cavity is designed with non-uniform gap width that corresponds to the volume distribution of recesses on the electronic component surface. The gap width is larger in regions where recesses have smaller volume and smaller in regions where recesses have larger volume, ensuring that the second insulating layer achieves uniform thickness across the entire surface despite the presence of recesses.
Solution Approach 2:
The invention changes the geometric parameters of the cavity (specifically the gap width between the cavity inner wall and electronic component side surface) based on the volume distribution of recesses. This parameter adjustment compensates for the volume differences in recesses, allowing the second insulating layer to maintain consistent thickness.
2Adaptability or versatility
If the recesses have varying volumes, then the electronic component can accommodate different wiring requirements, but the via hole depth and bottom area become inconsistent
Solution Approach 1:
The cavity structure provides different gap widths in different local regions to match the recess volume distribution. This local adaptation ensures that when the second insulating layer is formed, the via holes maintain consistent depth and bottom area despite the varying recess volumes, preserving both wiring adaptability and dimension consistency.
3Ease of manufacture
If the gap width is uniform, then the manufacturing process is simplified, but the second insulating layer thickness becomes non-uniform
Solution Approach 1:
Rather than using a uniform gap width, the invention employs a locally optimized gap width that varies according to the recess volume distribution. This approach maintains ease of manufacture while achieving uniform insulating layer thickness by matching the cavity geometry to the electronic component's surface features.
Data Source
AI summary
A wiring substrate includes a first insulating layer including a cavity, an electronic component in the cavity, and a second insulating layer on the first insulating layer. The second insulating layer covers the electronic component. A recess having a predetermined volume distribution is formed in an outermost layer of the electronic component that defines a surface of the electronic component facing away from the bottom of the cavity. The width of the gap between the side surface of the electronic component and the inner wall surface of the cavity in a plan view is determined based on the predetermined volume distribution. The second insulating layer is in the recess and the gap.