Wiring Substrate Branch Layout for Uniform Pad Reflow Welding
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Solution Overview
Problem
Existing wiring substrates for Micro LED display technology face challenges in ensuring uniform welding quality due to differences in temperature on the surfaces of pads during the reflow welding process, leading to issues like over-welding or false welding.
Innovation Solution
The proposed wiring substrate design includes a base substrate with connection lines and pads arranged in a specific configuration. The connection lines have branch portions that extend along a direction, ensuring uniform signal transmission. Additionally, the pads are grouped and connected by specific types of connection lines to maintain uniform line widths and spacings, enhancing welding uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If connection lines are designed with branch portions to connect multiple pads, then signal transmission capability is improved, but temperature uniformity across pads deteriorates
Solution Approach 1:
The connection lines are segmented into multiple branch portions, where each branch connects to different pads. This segmentation allows independent thermal management for each pad while maintaining signal transmission capability through the branched structure.
Solution Approach 2:
Different regions of the wiring substrate are designed with locally optimized connection line configurations. The branch portions are arranged to ensure that each pad receives appropriate thermal characteristics based on its specific functional requirements, achieving local temperature uniformity across different pad regions.
2Productivity
If pads are arranged in a dense configuration to increase integration, then device functionality is improved, but welding quality uniformity deteriorates
Solution Approach 1:
The connection lines are designed to create equipotential conditions across densely arranged pads by ensuring equal path lengths and consistent cross-sectional areas. This equipotential design ensures uniform current distribution and temperature profiles during reflow welding, maintaining welding quality uniformity even with high pad density.
Solution Approach 2:
The connection line parameters (width, thickness, material composition) are optimized and standardized to maintain consistent thermal and electrical properties across all pads. This parameter standardization ensures that welding conditions remain uniform across densely packed pads, achieving both high integration and manufacturing precision.
3Adaptability or versatility
If connection line width varies to optimize signal routing, then routing flexibility is improved, but welding consistency deteriorates
Solution Approach 1:
The connection line width is predetermined and standardized in the design phase to ensure uniform welding characteristics. This preliminary standardization of geometric parameters allows routing flexibility through topological variations while maintaining consistent physical dimensions that ensure welding consistency during manufacturing.
Data Source
AI summary
A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.