Wiring Substrate Protrusions for Rigidity and Heat Dissipation
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Solution Overview
Problem
Light emitting devices with thin substrates for improved heat conductivity suffer from reduced rigidity, leading to warping and deformation due to heat contraction, which affects the devices' performance and reliability.
Innovation Solution
A wiring substrate design featuring a tetragonal substrate with projections along its sides, where the substrate and insulating layers are raised in the thickness direction, enhancing the cross-sectional height and rigidity, and incorporating a metal layer with high reflectance to improve heat dissipation and light reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thin substrate is used to increase heat conductivity, then heat dissipation performance is improved, but rigidity is reduced causing warping and deformation
Solution Approach 1:
The patent introduces protrusions that extend in the thickness direction (third dimension) of the substrate. These protrusions increase the cross-sectional height and create a three-dimensional structure that enhances rigidity without increasing the planar footprint, thereby resolving the contradiction between thin substrate design for heat dissipation and the need for structural rigidity
Solution Approach 2:
The patent employs a composite structure consisting of the substrate, insulating layers, and protrusions with different material properties. The combination of these materials in a layered composite structure achieves both thermal management (through the thin substrate) and mechanical strength (through the protrusions and insulating layers), resolving the rigidity-heat conductivity trade-off
2Temperature
If a thin substrate is used to increase heat conductivity, then heat dissipation is improved, but the substrate becomes prone to warping and deformation
Solution Approach 1:
The protrusions extending in the thickness direction provide additional structural support that prevents warping and deformation. By adding vertical structure rather than increasing planar dimensions, the design maintains thin profile for heat conductivity while achieving structural stability through the three-dimensional geometry
Solution Approach 2:
The insulating layers are positioned between the substrate and upper structures to provide cushioning and stress distribution. This preemptive structural arrangement prevents stress concentration that could lead to warping, thereby maintaining structural stability while preserving the thin substrate design for heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the rigidity of the wiring substrate, reduces warping and deformation, maintains high heat conductivity, and enhances light emitting efficiency by efficiently releasing heat and increasing light reflectance, while also simplifying the manufacturing process and reducing costs.
Implementation Method 1
incorporating a metal layer with high reflectance to improve heat dissipation and light reflectance
Implementation Method 2
a thin substrate is used to increase the heat conductivity
Data Source
Figure 1A~1C
Figure 2
Figure 3A~3B
AI summary
A wiring substrate (1) includes a substrate (10), a first insulating layer (20) formed on the substrate (10), wiring patterns (30) formed on a first surface (R1) of the first insulating layer (20), and a second insulating layer (50) formed on the first surface (R1) of the first insulating layer (20). The second insulating layer (50) covers the wiring patterns (30) and includes a first opening (50X) that partially exposes adjacent wiring patterns (30) as a pad (CA). A projection (70) is formed in an outer portion of the substrate (10) located outward from where the first opening (50X) is arranged. The projection (70) rises in a thickness direction of the substrate (10).