Semiconductor X-Ray Detector Packaging for Large-Area Heat Dissipation
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Solution Overview
Problem
Current semiconductor X-ray detectors face challenges in heat management, making it difficult to produce large-area detectors with a large number of pixels due to cumbersome heat management systems.
Innovation Solution
The integration of an X-ray absorption layer and an electronics layer within a board made of electrically insulating materials, such as resin, fiberglass, or ceramic, where the X-ray absorption layer is bonded to the board with electrical contacts connected through vias to the electronics system, allowing for efficient heat dissipation and flexible design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If semiconductor X-ray detectors with a large number of pixels are produced, then detection precision is improved, but heat management becomes more difficult
Solution Approach 1:
The detector is divided into multiple pixels arranged in an array, with each pixel independently detecting X-ray photons. This segmentation allows for high detection precision across large areas while distributing heat generation across many small, manageable units rather than concentrating it in a single large sensor
Solution Approach 2:
The patent transitions from one-dimensional heat dissipation paths to two-dimensional heat distribution across the pixel array, with heat sinking structures positioned at multiple locations including beneath the sensor array. This dimensional expansion enables efficient heat management in large-area detectors
2Area of stationary object
If the area of semiconductor X-ray detectors is increased, then detection coverage is improved, but heat management becomes more difficult
Solution Approach 1:
The large-area detector is segmented into multiple small pixels that can be independently managed. Each pixel generates minimal heat, and the distributed architecture allows heat to be dissipated across the entire detector area rather than concentrating in a single large sensing element
Solution Approach 2:
Heat sinking structures serve as intermediary elements between the semiconductor pixels and the detector housing. These heat sinks are strategically positioned to conduct heat away from the pixel array efficiently, enabling large detector areas without compromising thermal management
3Measurement precision
If more pixels are integrated into the detector, then measurement precision is improved, but device complexity increases
Solution Approach 1:
All pixels in the array share common readout circuitry and processing pathways. The uniform design of each pixel allows for standardized manufacturing and simplifies the overall system architecture, reducing complexity despite the large number of pixels
Solution Approach 2:
Multiple pixels are combined into a single integrated array with shared support structures, bonding interfaces, and readout electronics. This merging approach reduces the total number of discrete components and simplifies assembly while maintaining high measurement precision through the large number of pixels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the production of large-area semiconductor X-ray detectors with improved heat management, enhancing their functionality and usability in applications like medical imaging and cargo scanning.
Implementation Method 1
Semiconductor X-ray detectors largely overcome this problem by direct conversion of X-ray into electric signals. A semiconductor X-ray detector may include a semiconductor layer that absorbs X-ray in wavelengths of interest. When an X-ray photon is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated
Data Source
AI summary
Disclosed herein is an apparatus suitable for detecting x-ray, comprising: an X-ray absorption layer configured to generate an electrical signal from an X-ray photon incident on the X-ray absorption layer; an electronics layer comprising an electronics system configured to process or interpret the electrical signal; and an interposer chip embedded in a board of an electrically insulating material; wherein the X-ray absorption layer is bonded to the electronics layer; wherein the electronics layer is bonded to the interposer chip.