Zigzag Electric Fuse Layout for Compact Semiconductor Design
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Solution Overview
Problem
Conventional electric fuses, particularly those with a straight line or clinch structure, face challenges in minimizing the occupying area and pitch between fuses due to potential damage to the interlayer insulating layer during cutting, which complicates the reduction of current values required for cutting and increases the overall circuit area in semiconductor devices.
Innovation Solution
The semiconductor device employs a configuration with multiple electric fuses arranged in a zigzag pattern, featuring projecting portions that diffuse heat and reduce damage to the interlayer insulating layer, allowing for smaller pitch and occupying area without harming the surrounding structure, even after resin sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a straight line electric fuse is used, then the occupying area is reduced, but the interlayer insulating layer receives physical damage such as cracks or thermal damage
Solution Approach 1:
The electric fuse is designed with a curved or meandering shape instead of a straight line configuration. This curvature allows the fuse to dissipate thermal energy more effectively during cutting, preventing concentrated heat damage to the surrounding interlayer insulating layer while maintaining a compact occupying area within the semiconductor device.
Solution Approach 2:
The electric fuse structure is divided into multiple segments or sections along its length, with each segment capable of independent thermal management. This segmentation allows the heat generated during cutting to be distributed across multiple zones rather than concentrated in one location, reducing the risk of thermal damage to the insulating layer while maintaining overall compactness.
2Area of stationary object
If the pitch between electric fuses is reduced, then the device area is minimized, but the damage region from one fuse affects adjacent fuses
Solution Approach 1:
The curved configuration of each electric fuse creates a natural thermal buffer zone between adjacent fuses. The meandering path increases the distance that thermal energy must travel to reach neighboring fuses, effectively isolating them even when placed in close proximity. This allows for reduced pitch between fuses while maintaining reliability and preventing cross-contamination of damage regions.
3Ease of operation
If a laser fuse is used, then the switching function is achieved, but a laser trimming unit is required which increases device complexity
Solution Approach 1:
The patent replaces the optical laser trimming system with an electrical cutting mechanism. The electric fuse is designed to be cut by passing current through it, utilizing electromagnetic heating and melting of the fuse material. This substitution eliminates the need for external laser trimming equipment, reducing device complexity while maintaining the switching function through electrical means that can be integrated into the semiconductor manufacturing process.
4Area of moving object
If the current value for cutting the electric fuse is reduced, then the occupying area of the transistor is reduced, but the fuse requires more heat generation efficiency
Solution Approach 1:
The curved shape of the electric fuse increases the surface area-to-volume ratio, enhancing heat generation efficiency through Joule heating when current passes through it. The meandering path ensures more uniform current distribution and heat generation along the fuse length, allowing for lower current values to achieve effective cutting while minimizing the occupying area of associated transistors and heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the reduction of the occupying area of electric fuses and the relevant circuit components while minimizing damage to the interlayer insulating layer, allowing for efficient cutting with lower current values and smaller pitch between fuses.
Implementation Method 1
how to cut a wiring by sending current through a wiring
Data Source
AI summary
The semiconductor device which has an electric straight line-like fuse with a small occupying area is offered.A plurality of projecting portions 10f are formed in the position shifted from the middle position of electric fuse part 10a, and, more concretely, are formed in the position distant from via 10e and near via 10d. A plurality of projecting portions 20f are formed in the position shifted from the middle position of electric fuse part 20a, and, more concretely, are formed in the position distant from via 20d and near 20e. That is, projecting portions 10f and projecting portions 20f are arranged in the shape of zigzag.