Zigzag Supporting Structure for 3D Semiconductor Stack Stability
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Solution Overview
Problem
The challenge in three-dimensional semiconductor devices is maintaining structural stability as the height of the stack structure increases, making it difficult to support the stack structure effectively.
Innovation Solution
A semiconductor device with a stack structure featuring alternately stacked interlayer insulating layers and electrode patterns, including a supporting structure that penetrates the stack and has a zigzag or bent shape to enhance stability, with the supporting structure comprising layers of different tensile and compressive strengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the stacking number of electrode patterns is increased to improve degree of integration, then the height of the stack structure is increased, but the structural stability deteriorates
Solution Approach 1:
The supporting structure is divided into multiple segments including a first supporting structure and a second supporting structure with different cross-sectional shapes. The first supporting structure has a first cross-sectional shape while the second supporting structure has a second cross-sectional shape that is different from the first. This segmentation allows each supporting structure to provide targeted support for different portions of the tall stack structure, thereby maintaining structural stability as the stacking number of electrode patterns increases to improve degree of integration.
2Length of stationary object
If the height of the stack structure is increased to improve degree of integration, then more electrode patterns can be stacked, but the ability to support the structure deteriorates
Solution Approach 1:
Different supporting structures are provided at different locations within the stack structure. The first supporting structure and the second supporting structure have different cross-sectional shapes tailored to support specific portions of the stack. This local quality approach ensures that each region of the tall stack structure receives appropriate support, enabling the stack structure to achieve greater height while maintaining sufficient supporting ability.
3Ease of manufacture
If a simple supporting structure is used, then the manufacturing process is simpler, but the supporting force is insufficient for tall stack structures
Solution Approach 1:
The supporting structure employs composite geometry with different cross-sectional shapes (first cross-sectional shape and second cross-sectional shape) to create a composite supporting system. This composite approach combines the advantages of different geometric configurations to provide enhanced supporting force for tall stack structures while maintaining manufacturability through systematic formation processes.
Data Source
AI summary
A semiconductor device includes a stack structure including alternately stacked interlayer insulating layers and electrode patterns. The semiconductor device also includes a plurality of contact plugs connected to the electrode patterns. The semiconductor device further includes a supporting structure penetrating the stack structure between two adjacent contact plugs of the plurality of contact plugs, wherein the supporting structure has a cross section extending in a zigzag shape.