ZnO Transparent Electrode for GaN LED Current Spreading

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Solution Overview

Problem

III-N based light emitting diodes face limitations due to low electrical conductivity of p-type layers, leading to current crowding and high forward voltage, which are exacerbated by the limitations of indium-tin oxide (ITO) current spreading layers, including high sheet resistance and optical absorption, and the complexity of mass production using conventional CVD techniques.

Innovation Solution

A light emitting diode with a zinc oxide (ZnO) transparent electrode layer, where a ZnO seed layer is formed using the sol-gel method and a porous ZnO bulk layer is grown through hydrothermal synthesis, improving current spreading performance and reducing forward voltage, while being suitable for mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ITO is used as current spreading layer, then electrical conductivity is improved, but sheet resistance increases and optical absorption occurs

Engineering Contradiction:
Improveelectrical conductivityVSAvoidsheet resistance and optical absorption
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces expensive ITO material with a cheaper ZnO-based transparent electrode layer that can be formed using sol-gel technique, eliminating the need for costly rare metal oxides while maintaining or improving electrical conductivity and reducing optical absorption

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material composition from ITO to ZnO-based transparent electrode, fundamentally altering the electrical and optical properties to achieve lower sheet resistance and reduced optical absorption, thereby improving current spreading performance

Inventive Principle:
Principle #35Parameter changes

2Reliability

If ITO layer thickness is increased to improve current spreading, then electrical conductivity improves, but manufacturing complexity increases due to process limitations

Engineering Contradiction:
Improvecurrent spreading performanceVSAvoidfabrication process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces conventional CVD mechanical deposition processes with a chemical sol-gel technique that allows for simpler, more controllable formation of transparent electrode layers, reducing fabrication process complexity while enabling thicker layers for improved current spreading

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition method from CVD to sol-gel technique, fundamentally altering the manufacturing process to achieve simpler fabrication steps, better layer uniformity, and improved control over electrode thickness and properties

Inventive Principle:
Principle #35Parameter changes

3Reliability

If current spreading layer is added to overcome ITO limitations, then current distribution improves, but forward voltage increases due to additional layers

Engineering Contradiction:
Improvecurrent distribution uniformityVSAvoidforward voltage
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The patent makes the ZnO-based transparent electrode layer perform multiple functions simultaneously: it serves as both the current spreading layer and the transparent electrode, eliminating the need for separate current blocking layers and reducing the overall device structure complexity while maintaining low forward voltage

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Object-generated harmful factors

If ZnO layer is formed using conventional CVD techniques, then transparency is improved, but productivity decreases due to excessive process time

Engineering Contradiction:
Improvelight absorptionVSAvoidmass production efficiency
Core Design Contradiction:
Object-generated harmful factorsVSProductivity

Solution Approach 1:

The patent replaces time-consuming conventional CVD deposition processes with a rapid sol-gel technique that forms ZnO-based transparent electrode layers much faster, significantly improving productivity and enabling mass production while maintaining excellent optical transparency and electrical conductivity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ZnO transparent electrode layer enhances current spreading and reduces forward voltage, improving the reliability and productivity of light emitting diodes, enabling operation under high current and voltage with uniform current distribution across light emitting cells.

Implementation Method 1

the ZnO seed layer is formed on the gallium nitride based second conductivity type semiconductor layer by a sol-gel method

Methodology Applied
Scientific EffectSol-gel method: Sol

Implementation Method 2

the ZnO bulk layer is grown on the ZnO seed layer through hydrothermal synthesis

Methodology Applied
Scientific EffectHydrothermal synthesis:

Data Source

PatentUS11063185B2Light emitting diode with zinc oxide layer and method of fabricating the same
Publication Date: 2021.07.13 SEOUL VIOSYS CO LTD
  • US11063185B2 patent drawing
  • US11063185B2 patent drawing
  • US11063185B2 patent drawing

AI summary

A light emitting diode with a zinc oxide layer and a method of fabricating the same are disclosed. The light emitting diode includes: a light emitting structure including a gallium nitride based first conductivity type semiconductor layer, a gallium nitride based second conductivity type semiconductor layer, and an active layer interposed therebetween; and a ZnO transparent electrode layer disposed on the second conductivity type semiconductor layer, wherein the ZnO transparent electrode layer comprises a ZnO seed layer and a ZnO bulk layer formed on the ZnO seed layer, wherein the ZnO bulk layer is porous compared to the ZnO seed layer, wherein an interface between the ZnO seed layer and the second conductivity type semiconductor layer is flatter than an interface between the ZnO seed layer and the ZnO bulk layer, and wherein the interface between the ZnO seed layer and the ZnO bulk layer has an irregular concavo-convex shape.