Deformable EMI Shielding for Reliable Electronics
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Summary
Problems
Electronic devices face challenges with signal contamination and uneven load distribution, particularly in small form factors, which can lead to solder joint failure, thermal inefficiency, and performance issues.
Innovation solutions
The use of a deformable EMI-spring multilayer system that combines a pre-formed spring core with an EMI shielding material, providing both electromagnetic interference shielding and improved load distribution across electronic components.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If rigid EMI shielding structures are used to protect electronic components, then electromagnetic interference shielding is improved, but load distribution becomes uneven causing concentrated edge and corner pressures
Why choose this principle:
The patent applies a flexible EMI shielding material that can deform under compression to distribute loads evenly. The material conforms to the shape of the electronic component and deforms uniformly when compressed by a thermal solution, preventing concentrated edge and corner pressures while maintaining EMI shielding effectiveness.
Principle concept:
If rigid EMI shielding structures are used to protect electronic components, then electromagnetic interference shielding is improved, but load distribution becomes uneven causing concentrated edge and corner pressures
Why choose this principle:
The patent changes the mechanical parameters of the EMI shielding material by selecting materials with specific compressive moduli (0.5-5 MPa) that allow controlled deformation. This parameter adjustment enables the material to transition from a rigid state that concentrates stress to a compliant state that distributes load uniformly across the component surface.
Application Domain
Data Source
AI summary:
The use of a deformable EMI-spring multilayer system that combines a pre-formed spring core with an EMI shielding material, providing both electromagnetic interference shielding and improved load distribution across electronic components.
Abstract
A shielding structure and method for assembling a shielding structure for an electronic component. The shielding structure includes a core comprising an elastic material and at least a spring part of the core comprising an arch. The structure further includes an electromagnetic interference (EMI) shielding material affixed to the core. The method for producing the shielding structure includes forming a core comprising an elastic material, wherein the core includes at least a spring part comprising one or more arches. The method further includes covering at least a part of the core in an EMI shielding material.