Efficient Heat Dissipation in Semiconductor Devices
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Summary
Problems
Current semiconductor devices face challenges in effectively dissipating heat, particularly in power amplifiers used in wireless communication devices, which limits their output power and size efficiency.
Innovation solutions
A semiconductor device design featuring a substrate with transistors, operation electrodes, and alternating layers of interlayer insulating films and conductor films, where specific openings in the insulating films enhance heat conduction from the operation electrode to the conductor films, allowing for efficient heat dissipation through a structured heat transfer path.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the power output of a power amplifier is improved, then the output power increases, but heat dissipation becomes insufficient
Why choose this principle:
The patent extends the heat transfer path from a single-layer structure to a multi-layer stacked configuration with conductor films at different heights. The openings in interlayer insulating films are positioned at different vertical levels, creating a three-dimensional heat conduction pathway that increases the effective heat dissipation area and efficiency without increasing the horizontal footprint of the device.
Principle concept:
If the power output of a power amplifier is improved, then the output power increases, but heat dissipation becomes insufficient
Why choose this principle:
The heat transfer path is divided into multiple segments through the stacked conductor films (first layer conductor film, second layer conductor film, etc.) separated by interlayer insulating films. Each conductor film acts as an independent heat conduction segment, and the cumulative effect of multiple segments provides enhanced heat dissipation capability compared to a single continuous path.
Application Domain
Data Source
AI summary:
A semiconductor device design featuring a substrate with transistors, operation electrodes, and alternating layers of interlayer insulating films and conductor films, where specific openings in the insulating films enhance heat conduction from the operation electrode to the conductor films, allowing for efficient heat dissipation through a structured heat transfer path.
Abstract
A first layer conductor film is connected to an operation electrode through an opening in a first layer interlayer insulating film. An opening in a second layer interlayer insulating film is encompassed by the first layer conductor film in plan view. A second layer conductor film is connected to the first layer conductor film through the opening in a second layer interlayer insulating film. The average, along a first direction, of distances in a second direction, which is perpendicular to the first direction, from the opening in the first layer interlayer insulating film to the side surface of the opening in the second layer interlayer insulating film is greater than or equal to a distance in a height direction from an upper opening plane of the opening in the first layer interlayer insulating film to a lower opening plane of the opening in the second layer interlayer insulating film.