Efficient Heat Dissipation in Electrical Wires Using Conduction Path Design
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Summary
Problems
Existing methods for heat dissipation in electrical wires, such as those in vehicles, face challenges due to low thermal conductivity of air and potential deformation of insulating covers leading to reduced heat dissipation, especially with larger wire cross-sectional areas.
Innovation solutions
A conduction path design featuring a wire with an insulating cover and a routing member with a curved groove and cover configuration that minimizes pressure on the wire, allowing efficient heat transfer through the routing member and cover while preventing deformation and permanent gaps, using a metal routing member and cover for enhanced thermal conductivity and electromagnetic shielding.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a heat-dissipating cover member with high thermal conductivity is provided on the insulating cover, then heat dissipation efficiency is improved, but the thermal conductivity of air limits further heat dissipation enhancement
Why choose this principle:
The patent introduces a cooling member as an intermediary element between the wire and the surrounding environment. This cooling member has a cooling surface that directly contacts the insulating cover and conducts heat away from the wire, serving as a mediator to overcome the low thermal conductivity of air and enhance heat dissipation capacity
Principle concept:
If a heat-dissipating cover member with high thermal conductivity is provided on the insulating cover, then heat dissipation efficiency is improved, but the thermal conductivity of air limits further heat dissipation enhancement
Why choose this principle:
The patent transitions from a one-dimensional heat dissipation approach (cover member on insulating cover) to a multi-dimensional approach by introducing a routing groove structure with a cooling member that creates additional heat transfer paths through the groove walls and cooling surface, effectively utilizing three-dimensional space for heat dissipation
Application Domain
Data Source
AI summary:
A conduction path design featuring a wire with an insulating cover and a routing member with a curved groove and cover configuration that minimizes pressure on the wire, allowing efficient heat transfer through the routing member and cover while preventing deformation and permanent gaps, using a metal routing member and cover for enhanced thermal conductivity and electromagnetic shielding.
Abstract
A conduction path includes: a wire that has a circular cross section and includes a conductive body having an outer periphery covered by an insulating cover; a routing member that includes a routing groove in which the wire is routed; and a cover that is configured to be attached to the routing member and to cover the routing groove, wherein a curved surface having a curvature radius that is larger than the radius of the wire is formed in an inner surface of the routing groove, and in a state in which the cover is attached to the routing member, a distance between the cover and the inner surface of the routing groove in a direction that is perpendicular to an inward surface of the cover is the same length as the diameter of the wire.