Flexible Connectors for Reliable Semiconductor Devices
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Summary
Problems
Semiconductor packages experience cracking and failure due to thermomechanical stress caused by mismatched coefficients of thermal expansion between the package and the PCB, leading to disrupted electrical coupling and rendering the assembly inoperable, especially under cyclic loading and extreme temperature fluctuations.
Innovation solutions
The implementation of an array of flexible connectors that can transform between resting and loaded configurations, such as compressed or stretched configurations, to absorb and dissipate thermomechanical stress without cracking, using a conductive element and a support material that deforms elastically to maintain electrical connectivity.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If rigid connectors are used to couple the semiconductor package to the PCB, then electrical connectivity is established, but thermomechanical stress causes cracking and failure under cyclic thermal loading
Why choose this principle:
The connector is designed with a flexible body that can dynamically change its shape between a first configuration (when no stress is applied) and a second configuration (when thermomechanical stress is applied). This dynamic adaptability allows the connector to accommodate thermal expansion mismatches without cracking, resolving the contradiction between maintaining electrical connectivity and withstanding thermomechanical stress.
Principle concept:
If rigid connectors are used to couple the semiconductor package to the PCB, then electrical connectivity is established, but thermomechanical stress causes cracking and failure under cyclic thermal loading
Why choose this principle:
The flexible connector changes its physical parameters (shape, curvature) in response to thermomechanical stress. The body transitions from a relaxed state to a stressed state, altering its geometric parameters to absorb thermal expansion differences between the semiconductor package and PCB, thereby preventing failure while maintaining connectivity.
Application Domain
Data Source
AI summary:
The implementation of an array of flexible connectors that can transform between resting and loaded configurations, such as compressed or stretched configurations, to absorb and dissipate thermomechanical stress without cracking, using a conductive element and a support material that deforms elastically to maintain electrical connectivity.
Abstract
Semiconductor devices having an array of flexible connectors configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor assembly includes a substrate coupled to an array of flexible connectors. Each flexible connector can be transformed between a resting configuration and a loaded configuration. Each flexible connector can include a conductive wire electrically coupled to the substrate and a support material at least partially surrounding the conductive wire. The conductive wire can have a first shape when the flexible connector is in the resting configuration and a second, different shape when the flexible connector is in the loaded configuration.