Galvanic Isolation in IC Packages: Magnetic Core Solutions
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Summary
Problems
Magnetic-coupling isolation barriers used in electronic systems face manufacturing challenges, particularly for integrated circuit (IC) packages due to the inclusion of a magnetic core, which complicates IC package design and increases costs.
Innovation solutions
A galvanically-isolated integrated circuit package design that includes a substrate with semiconductor dies, a molding material forming a package body with an aperture for a ferromagnetic core, and coils configured as a transformer to magnetically couple the semiconductor dies, allowing for the ferromagnetic core to be inserted after the package body is formed, enabling magnetic isolation without the need for a permanent magnetic core during initial fabrication.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a magnetic core is included in the IC package for galvanic isolation, then effective magnetic coupling and galvanic isolation are achieved, but manufacturing complexity and fabrication costs increase
Why choose this principle:
The patent divides the transformer structure into separate components: the magnetic core and the coil assembly. The coil assembly is fabricated as a complete unit with integrated windings and lead frames, then separately assembled with the magnetic core in a second step. This segmentation allows the coil assembly to be manufactured using standard PCB and wire bonding processes, while the magnetic core is added later through simple insertion into a molded cavity, significantly reducing overall manufacturing complexity.
Principle concept:
If a magnetic core is included in the IC package for galvanic isolation, then effective magnetic coupling and galvanic isolation are achieved, but manufacturing complexity and fabrication costs increase
Why choose this principle:
The patent performs preliminary fabrication of the coil assembly including winding the coils, creating the lead frame, and forming the insulating housing before adding the magnetic core. The aperture for the magnetic core is pre-formed in the insulating housing during the molding process. This preliminary action allows the majority of the complex fabrication to be completed using automated processes, with only a simple insertion step remaining.
Application Domain
Data Source
AI summary:
A galvanically-isolated integrated circuit package design that includes a substrate with semiconductor dies, a molding material forming a package body with an aperture for a ferromagnetic core, and coils configured as a transformer to magnetically couple the semiconductor dies, allowing for the ferromagnetic core to be inserted after the package body is formed, enabling magnetic isolation without the need for a permanent magnetic core during initial fabrication.
Abstract
Systems, structures, circuits, and methods provide integrated circuit (IC) packages or modules having a transformer initially fabricated without a core. First and second semiconductor dies are disposed on a lead frame or other substrate. First and second coils are configured to about an aperture region. A hole or aperture may be formed in the IC package in the aperture region so a core may be placed and received in the aperture at a later time, e.g., such as after testing. The core may be a soft ferromagnetic material, e.g., metal, ferrite, and/or or a moldable material. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.