Heat Dissipation Design for High-Frequency Modules
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Summary
Problems
Existing high frequency modules face challenges in improving heat dissipating characteristics, leading to increased temperature of electronic components such as acoustic wave filters.
Innovation solutions
A high frequency module design featuring a mounting substrate, an acoustic wave filter covered by a resin layer, and a shield layer in contact with the filter's main surface far from the substrate, enhancing heat dissipation.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the acoustic wave filter is covered only by a resin layer, then the manufacturing process is simple, but the heat dissipating characteristics are insufficient leading to temperature increase
Why choose this principle:
The shield layer is integrated into the existing module structure, serving both as an electromagnetic shield and a heat dissipation path. This merging of functions allows heat to be conducted to the shield layer without adding separate cooling components, thus improving temperature control while maintaining structural simplicity.
Principle concept:
If the acoustic wave filter is covered only by a resin layer, then the manufacturing process is simple, but the heat dissipating characteristics are insufficient leading to temperature increase
Why choose this principle:
The resin layer acts as an intermediary thermal conductor between the acoustic wave filter and the shield layer. By optimizing the resin layer's thermal conductivity and contact area, heat is effectively transferred to the shield layer which then dissipates heat to the mounting substrate, solving the heat dissipation problem without direct filter-to-substrate contact.
Application Domain
Data Source
AI summary:
A high frequency module design featuring a mounting substrate, an acoustic wave filter covered by a resin layer, and a shield layer in contact with the filter's main surface far from the substrate, enhancing heat dissipation.
Abstract
Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The acoustic wave filter is arranged near the first main surface of the mounting substrate. The resin layer is arranged on the first main surface of the mounting substrate and covers an outer peripheral surface of the acoustic wave filter. The shield layer covers the resin layer and the acoustic wave filter. The shield layer is in contact with a second main surface of the acoustic wave filter that is far from the mounting substrate.