Integrated Heater Devices for Efficient Microelectronic Testing
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Summary
Problems
Conventional methods for testing power and thermal operating conditions of microelectronic systems are inadequate, as they often require building specific heater packages for each system, which is time-consuming, expensive, and does not accurately model real-world conditions, especially when other system components and airflow dynamics are not fully replicated.
Innovation solutions
Incorporating a heater device with a resistive element and switching circuitry into microelectronic devices, such as memory devices, that can emulate operational power consumption and heat generation, allowing for the simulation of anticipated power and thermal conditions without a complete system or memory controller, using resistive elements to draw anticipated current and generate heat, thereby testing power and thermal conditions on-site.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If conventional heater packages are built for each system, then power and thermal conditions can be tested, but the process is time-consuming and costly
Why choose this principle:
The patent integrates a heater device directly into the microelectronic device itself, making the device capable of serving both its primary function and thermal testing function. This eliminates the need for separate heater packages for different systems, as the integrated heater can be universally applied across various microelectronic devices to emulate power consumption and heat generation under different operating conditions.
Principle concept:
If conventional heater packages are built for each system, then power and thermal conditions can be tested, but the process is time-consuming and costly
Why choose this principle:
The heater device is pre-integrated into the microelectronic device during manufacturing, allowing thermal and power condition testing to be performed immediately without requiring subsequent assembly of separate heater packages. This preliminary integration eliminates time-consuming setup procedures and enables rapid testing under anticipated operating conditions.
Application Domain
Data Source
AI summary:
Incorporating a heater device with a resistive element and switching circuitry into microelectronic devices, such as memory devices, that can emulate operational power consumption and heat generation, allowing for the simulation of anticipated power and thermal conditions without a complete system or memory controller, using resistive elements to draw anticipated current and generate heat, thereby testing power and thermal conditions on-site.
Abstract
A memory device includes at least one die and a heater device. The heater device includes a first switch element electrically connected to a power supply connection and the at least one die, a second switch element electrically connected to the first switch element, and a resistive element electrically connected to the second switch element and a ground connection. A method includes configuring the first switching element of the heater device to electrically connect the second switching element of the heater device to a power supply connection, configuring the second switching element to electrically connect one of a first resistor or a second resistor of the resistive element to the first switching element, and applying an voltage across the first resistor or the second resistor that is electrically connected to the first switching element.