Reducing Contamination in Semiconductor CVD Tools with Grounding Innovations
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Summary
Problems
The existing chemical vapor deposition (CVD) processes in semiconductor manufacturing face issues with contamination due to the grounding strap rubbing against the pumping plate component, leading to particulate dislodgment and plastic deformation, which reduces yield and increases downtime.
Innovation solutions
A grounding component with a deformation region featuring a recessed edge is introduced to minimize contact with the pumping plate component, reducing plastic deformation and particulate dislodgment, while using a material with specific mechanical properties to enhance durability.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the grounding strap is made compliant to discharge plasma residual charge, then electrical safety is improved, but the grounding strap rubs against the pumping plate component causing particulate dislodgment and contamination
Why choose this principle:
A deformation region is introduced as an intermediary element between the grounding strap and the pumping plate component. This deformation region absorbs the mechanical stress and prevents direct rubbing contact, thereby eliminating particulate dislodgment while maintaining the grounding strap's compliance for electrical safety
Principle concept:
If the grounding strap is made compliant to discharge plasma residual charge, then electrical safety is improved, but the grounding strap rubs against the pumping plate component causing particulate dislodgment and contamination
Why choose this principle:
The grounding strap's material properties are modified by changing its cross-sectional geometry in the deformation region. This parameter change allows the strap to be more compliant in the deformation region to prevent rubbing, while maintaining sufficient structural integrity elsewhere to perform its grounding function
Application Domain
Data Source
AI summary:
A grounding component with a deformation region featuring a recessed edge is introduced to minimize contact with the pumping plate component, reducing plastic deformation and particulate dislodgment, while using a material with specific mechanical properties to enhance durability.
Abstract
Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.