Semiconductor Device Design for Accurate Temperature Detection
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Summary
Problems
Conventional semiconductor devices face challenges in accurately detecting temperature rises of driving semiconductor chips due to potential short-circuits and limited design freedom in lead patterning when chips are placed on the same island, and difficulties in thermal conductivity when tabs are divided, affecting the reliability and efficiency of temperature detection.
Innovation solutions
A semiconductor device design featuring isolated mount regions with a projecting area and recessed areas, using an insulating adhesive sheet to attach the controlling semiconductor chip, which enhances thermal conductivity and prevents short-circuits, allowing for accurate temperature detection and independent potential application.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If the driving semiconductor chip and the controlling semiconductor chip are placed on the same island, then the temperature rising state of the driving semiconductor chip can be accurately detected, but the two semiconductor chips are more likely to be short-circuited to each other due to processing errors
Why choose this principle:
The patent divides the mount structure into separate first and second mount regions, isolating the driving semiconductor chip and controlling semiconductor chip spatially. This segmentation prevents short-circuits between chips while maintaining temperature detection capability through the isolated mount regions that can still thermally couple the chips.
Principle concept:
If the driving semiconductor chip and the controlling semiconductor chip are placed on the same island, then the temperature rising state of the driving semiconductor chip can be accurately detected, but the two semiconductor chips are more likely to be short-circuited to each other due to processing errors
Why choose this principle:
The patent introduces an insulating adhesive sheet as an intermediary between the driving semiconductor chip and the controlling semiconductor chip. This intermediary material provides electrical insulation to prevent short-circuits while allowing thermal conduction for temperature detection, thus resolving the contradiction between reliability and measurement precision.
Application Domain
Data Source
AI summary:
A semiconductor device design featuring isolated mount regions with a projecting area and recessed areas, using an insulating adhesive sheet to attach the controlling semiconductor chip, which enhances thermal conductivity and prevents short-circuits, allowing for accurate temperature detection and independent potential application.
Abstract
Conventional semiconductor devices have a problem that it is difficult to prevent the short circuit between chips and to improve accuracy in temperature detection with the controlling semiconductor chips. In a semiconductor device of the present invention, a first mount region to which a driving semiconductor chip is fixedly attached and a second mount region to which a controlling semiconductor chip is fixedly attached are formed isolated from each other. A projecting area is formed in the first mount region, and the projecting area protrudes into the second mount region. The controlling semiconductor chip is fixedly attached to the top surfaces of the projecting area and the second mount region by use of an insulating adhesive sheet material. This structure prevents the short circuit between the two chips, and improves accuracy in temperature detection with the controlling semiconductor chip.