Stacked Optoelectronic Assembly for High-Speed 3D Sensing
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Summary
Problems
Conventional optoelectronic assemblies with top-emitting VCSELs face limitations due to parasitic elements, cross-talk, and electromagnetic interference, which restrict high-speed operations and increase manufacturing complexity and costs, especially in applications like 3D imaging and LIDAR that require precise control of laser pulses.
Innovation solutions
The optoelectronic assembly features a stacked configuration with a back-side emitting VCSEL and a laser driver circuit on a printed circuit board, eliminating wire bonds and using conductive pillars or Direct Bond Interconnects for electrical connections, thereby minimizing parasitic inductance and allowing higher frequency control of the VCSELs.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If wire bonds are used to connect the VCSEL to the driver circuit, then electrical connection is established, but parasitic inductance and capacitance increase, limiting the frequency response
Why choose this principle:
The patent removes wire bonds from the system entirely, replacing them with direct flip-chip bonding between the VCSEL and driver circuit. This extraction of the problematic wire bond interconnect eliminates the associated parasitic inductance and capacitance while maintaining electrical connectivity through direct metallurgical bonding.
Principle concept:
If wire bonds are used to connect the VCSEL to the driver circuit, then electrical connection is established, but parasitic inductance and capacitance increase, limiting the frequency response
Why choose this principle:
The patent transitions from a planar layout with wire bonds extending in three-dimensional space to a stacked three-dimensional integration architecture. The VCSEL is flip-chip bonded directly onto the driver circuit substrate, creating vertical interconnections that eliminate the long wire bond loops and reduce parasitic elements through spatial reorganization.
Application Domain
Data Source
AI summary:
The optoelectronic assembly features a stacked configuration with a back-side emitting VCSEL and a laser driver circuit on a printed circuit board, eliminating wire bonds and using conductive pillars or Direct Bond Interconnects for electrical connections, thereby minimizing parasitic inductance and allowing higher frequency control of the VCSELs.
Abstract
An optoelectronic assembly is disclosed. The disclosed assembly includes one or more lasers formed on a first substrate, and a programmable driver circuit formed on a second substrate configured as an integrated circuit. The first and second substrates are mounted on a third substrate in a stacked arrangement.