Wiring Board Design for High-Frequency Signal Reliability
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Summary
Problems
Existing wiring boards face challenges in efficiently transmitting high-frequency signals and maintaining mechanical strength due to limitations in signal delay reduction and mechanical integrity, particularly when using sintered mullite-based substrates for electronic components.
Innovation solutions
A wiring board structure featuring an insulating substrate with alternating layers of mullite and aluminum oxide, combined with manganese or molybdenum compounds and silicate phases, which reduces signal delays and enhances mechanical strength by optimizing the relative dielectric constants and bonding strengths between the substrate and conductors.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If a single-layer sintered mullite substrate is used, then mechanical strength is improved, but signal transmission delay increases
Why choose this principle:
The substrate is divided into two distinct layers: a lower layer containing mullite particles (providing mechanical strength) and an upper layer with different composition (optimizing signal transmission). This segmentation allows each layer to fulfill its specific function, resolving the contradiction between strength and signal delay
Principle concept:
If a single-layer sintered mullite substrate is used, then mechanical strength is improved, but signal transmission delay increases
Why choose this principle:
Different regions of the substrate are given different material compositions tailored to local requirements: the lower layer near the conductor uses mullite for strength, while the upper layer uses a composition optimized for low dielectric constant to minimize signal delay. This local differentiation resolves the conflicting requirements
Application Domain
Data Source
AI summary:
A wiring board structure featuring an insulating substrate with alternating layers of mullite and aluminum oxide, combined with manganese or molybdenum compounds and silicate phases, which reduces signal delays and enhances mechanical strength by optimizing the relative dielectric constants and bonding strengths between the substrate and conductors.
Abstract
A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.