DEVICE, INTEGRATED CERAMIC RESONATOR, AND METHOD FOR MANUFACTURING AN INTEGRATED DEVICE
The integration of a ceramic resonator with a surface-mounted integrated circuit package addresses size and stability issues in existing oscillators, enabling high-frequency operation with improved stability and reduced RF instabilities.
BR112025019523A2Pending Publication Date: 2026-07-14QUALCOMM INC
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Patent Information
- Application Number
- BR112025019523
- Authority / Receiving Office
- BR · BR
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-03-24
- Filing Date
- 2024-03-11
- Publication Date
- 2026-07-14
AI Technical Summary
Technical Problem
Existing oscillators using quartz crystals or bulk-acoustic-wave resonators face issues with size limitations, mechanical sensitivity, and manufacturing difficulties, leading to RF instabilities and inconsistent frequency stability when coupled to active oscillator circuits.
Method used
A ceramic resonator with a conductive periphery and insulated conductive rod is integrated with a surface-mounted integrated circuit package, eliminating the need for wire coupling and enabling direct surface mounting, thereby reducing spurious capacitances and inductances.
Benefits of technology
The solution achieves high-frequency operation with improved frequency stability and reduced RF instabilities, allowing for compact and reliable RF oscillators with high quality factors.
✦ Generated by Eureka AI based on patent content.
Abstract
In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface- mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.
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