A method for increasing the height of a flash lamp device

Abstract

The present invention relates to the technical field of flashlight devices, and in particular to a method for heightening a flashlight device, wherein a wire support and a substrate are bonded by solder paste, and white glue I is poured at the gap between the wire supports, a chip is fixed on the pad of the wire support by a flip-chip process, and a fluorescent film is covered on the surface of the chip; white glue II is poured around the chip and the fluorescent film to form a device surface; the whole product is cut along the cutting path to obtain a single flashlight device product. The thickness of the device finally obtained by the present invention can be above 1.0 mm, which can meet the needs of the existing and future product designs of the terminal, solve the problems of increased development processes, complicated processes, and narrowed selection range in the later stage, and the photoelectric performance is stronger, and the light spot and uniformity of the product are better.

Description

Technical Field

[0001] The invention relates to the technical field of flash lamp devices, and in particular to a method for heightening a flash lamp device. Background Art

[0002] At present, the products in the field of mobile phone flash applications on the market include ceramic, bracket and CSP structural designs. The mainstream packaging product sizes are 2016 and 1016 sizes, but the thickness of these products is relatively thin (thickness ≤ 1.0mm). In mobile phone customer terminal applications, the product design requires a high single lamp bead product. Therefore, there will be certain limitations for terminal development and design.

[0003] There are two existing development and design methods: one is to raise the position of the flashlight through the PCB substrate during the development of the terminal design to compensate for the thickness of the lamp bead unit; the other is to raise the PCB of the lamp bead unit to meet the development size requirements of the terminal. The former increases the design cost for the client and requires the design to be bound to the lamp bead, which narrows the selection range; the latter raises the lamp bead unit, increases the production process, is more complicated, and has a significant increase in cost, so the overall development cost of the terminal product will also increase. Summary of the invention

[0004] The present invention solves the problem in the related art that the thickness of the lamp bead monomer is relatively thin, which results in an increase in terminal development processes, complex processes, and a narrowing of the range of models available for selection. A method for heightening a flash lamp device is proposed, wherein a wire bracket and a substrate are bonded together using solder paste, and white glue I is poured at the gap between the wire brackets, a chip is fixed on the pad of the wire bracket using a flip-chip process, and a fluorescent film is covered on the surface of the chip; white glue II is poured around the chip and the fluorescent film to form a device surface; the entire product is cut along the cutting path to obtain a single flash lamp device product. Through this method, the thickness of the final device can be above 1.0 mm, which can meet the needs of existing and future terminal product designs, and solves the problems of increased development processes, complex processes, and a narrowing of the range of models available for selection in the later stage.

[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions: a method for heightening a flash lamp device, the specific steps are as follows:

[0006] S1. Production of substrate: Select a substrate of appropriate size according to the needs and embed conductive copper pillars in the substrate;

[0007] S2. Production of wire bracket: Punch the wire bracket to make the length, width and pad size consistent with the substrate;

[0008] S3, the substrate and the wire bracket are bonded: the wire bracket and the substrate are bonded with solder paste to form a whole, and then white glue I is poured in the gap of the wire bracket;

[0009] S4, flip chip: fix the chip on the pad of the wire bracket by flip chip process, and cover the surface of the chip with fluorescent film;

[0010] S5, pouring white glue II: pouring white glue II around the wafer and the fluorescent film to form the device surface;

[0011] S6. Cutting: Cut the entire product along the cutting path to obtain a single flash lamp device product.

[0012] As a preferred method, a layer of white glue III with a circular blank in the middle is applied to the surface of the device sealed with white glue II to form a circular light-emitting area.

[0013] As a preferred method, before cutting, a transparent film or a diffusion film is coated on the surface of the fluorescent film and the white glue III.

[0014] As a preferred method, the white glue III is made of EMC / SMC material, and the thickness of the white glue III is less than 0.1 mm.

[0015] As a preferred method, the transparent film or the diffusion film is made of EMC / SMC material and has a thickness of 0.05-0.1 mm.

[0016] As a preferred method, the filling height of the white glue I is flush with the surface of the pad of the wire support.

[0017] As a preferred method, the height of the white glue II is flush with the height of the fluorescent film.

[0018] As a preferred method, the substrate is made of aluminum oxide or aluminum nitride ceramics and has a thickness of 0.2 to 1.0 mm.

[0019] As a preferred method, the material of the wire support is copper or copper alloy and the thickness of the wire support is 0.1-0.5 mm.

[0020] As a preferred method, the white glue I and white glue II are both made of EMC / SMC material.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention adheres the wire bracket to the substrate by using solder paste, and injects white glue I at the gap of the wire bracket, fixes the chip on the pad of the wire bracket by using a flip-chip process, and covers the surface of the chip with a fluorescent film; injects white glue II around the chip and the fluorescent film to form the device surface; cuts the entire product along the cutting path to obtain a single flash device product; the thickness of the final device can be above 1.0 mm, which can meet the needs of existing and future terminal product designs, thereby solving the problems of increased development processes, complex processes, and a narrowing of the selection range; the photoelectric performance is stronger, and the product's light spot and uniformity are better; in addition, a layer of white glue III with a circular blank in the middle is brushed on the surface of the product to form a circular light-emitting area, the product has better light efficiency, better uniformity, and is a small-size circular light output, which is beneficial to secondary optical design and products with improved optical chromatic aberration uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of forming a circular light-emitting area in the present invention.

[0024] In the figure:

[0025] 1. Substrate, 2. Wire bracket, 3. Wafer, 4. Fluorescent film, 5. Transparent film or diffusion film, 6. Conductive copper column, 7. White glue I, 8. White glue II, 9. White glue III, 10. Solder paste. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0028] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0029] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0030] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0031] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0032] like Figures 1 to 2As shown, a method for heightening a flash lamp device, the specific steps are as follows:

[0033] S1. Preparation of substrate 1: Select a substrate 1 of appropriate size according to needs and embed a conductive copper column 6 in the substrate 1;

[0034] S2, manufacturing the wire support 2: punching the wire support 2 so that the length, width and pad size are consistent with the substrate 1;

[0035] S3, the substrate 1 is bonded with the wire support 2: the wire support 2 and the substrate 1 are bonded with solder paste 10 (wherein the solder paste 10 is a high-temperature solder paste with a temperature of more than 280° C.) to form a whole, and then white glue I7 is poured into the gap of the wire support 2;

[0036] S4, flip chip 3: fix the chip 3 on the pad of the lead support 2 by using a flip chip process, and cover the surface of the chip 3 with a fluorescent film 4, specifically, the fluorescent powder can be attached to the surface of the chip 3 by using a film bonding process or a spraying process, so as to form the fluorescent film 4;

[0037] S5, pouring white glue II 8: pouring white glue II 8 around the chip 3 and the fluorescent film 4 to form the device surface;

[0038] S6. Cutting: Cut the entire product along the cutting path to obtain a single flash lamp device product.

[0039] In one embodiment, a layer of white glue III9 with a circular blank in the middle is brushed on the surface of the device after sealing with white glue II 8 to form a circular luminous area. The light from the four corners is shielded by the brushed white glue III9. In this way, the surface of the product can be made to emit light in a circular shape, which is beneficial to secondary optical design and improving the uniformity of optical chromatic aberration.

[0040] In one embodiment, according to needs, before cutting, a layer of transparent film or diffusion film 5 can be coated on the surface of the fluorescent film 4 and the white glue III 9 by using a process of injection and injection molding.

[0041] In one embodiment, the white glue III 9 is made of EMC / SMC material, and the thickness of the white glue III 9 is less than 0.1 mm.

[0042] In one embodiment, the transparent film or the diffusion film 5 is made of EMC / SMC material and has a thickness of 0.05-0.1 mm.

[0043] In one embodiment, the filling height of white glue I7 is flush with the pad surface of the wire support 2, and the height is 100μm to 500μm. The part of white glue I7 protruding from the pad surface can be cleaned with a cleaning agent to wash away the protruding white glue I7 and make it flush with the pad surface of the wire support 2.

[0044] In one embodiment, the height of the white glue II 8 is flush with the height of the fluorescent film 4, which can improve the reflectivity of the product and improve the side light leakage of the product, thereby enhancing the luminous center intensity of the product.

[0045] In one embodiment, the substrate 1 is made of aluminum oxide or aluminum nitride ceramics and has a thickness of 0.2-1.0 mm.

[0046] In one embodiment, the material of the wire support 2 is copper or copper alloy and the thickness of the wire support 2 is 0.1-0.5 mm.

[0047] In one embodiment, white glue I 7 and white glue II 8 are both made of EMC / SMC material.

[0048] The above are preferred implementation modes of the present invention. Those skilled in the art to which the present invention belongs can also change and modify the above implementation modes. Therefore, the present invention is not limited to the above specific implementation modes. Any obvious improvements, substitutions or modifications made by those skilled in the art on the basis of the present invention belong to the protection scope of the present invention.

Claims

1. A method for heightening a flash lamp device, characterized in that: Here are the steps: S1. Manufacturing of a substrate (1): selecting a substrate (1) of suitable size according to needs and embedding a conductive copper column (6) in the substrate (1); S2. Manufacturing the wire support (2): punching the wire support (2) so that the length, width and pad size are consistent with those of the substrate (1); S3, bonding the substrate (1) and the wire support (2): the wire support (2) and the substrate (1) are bonded together using solder paste (10) to form a whole, and then white glue I (7) is poured into the gap of the wire support (2); S4, flip chip (3): fix the chip (3) on the pad of the wire support (2) by using a flip chip process, and cover the surface of the chip (3) with a fluorescent film (4); S5, pouring white glue II (8): pouring white glue around the chip (3) and the fluorescent film (4) Ⅱ(8) thereby forming the device surface; S6. Cutting: Cut the entire product along the cutting path to obtain a single flash lamp device product with a thickness of more than 1.0 mm.

2. The method for heightening a flash lamp device according to claim 1, characterized in that: A layer of white glue III (9) with a circular blank in the middle is applied to the surface of the device sealed with white glue II (8) to form a circular light-emitting area.

3. The method for heightening a flash lamp device according to claim 2, characterized in that: Before cutting, a transparent film or a diffusion film (5) is coated on the surface of the fluorescent film (4) and the white glue III (9).

4. The method for heightening a flash lamp device according to claim 2, characterized in that: The white glue III (9) is made of EMC / SMC material, and the thickness of the white glue III (9) is less than 0.1 mm.

5. The method for heightening a flash lamp device according to claim 3, characterized in that: The transparent film or diffusion film (5) is made of EMC / SMC material and has a thickness of 0.05-0.1 mm.

6. The method for heightening a flash lamp device according to claim 1, characterized in that: The filling height of the white glue I (7) is flush with the surface of the soldering pad of the wire support (2).

7. The method for heightening a flash lamp device according to claim 1, characterized in that: The height of the white glue II (8) is flush with the height of the fluorescent film (4).

8. The method for heightening a flash lamp device according to claim 1, characterized in that: The substrate (1) is made of aluminum oxide or aluminum nitride ceramics and has a thickness of 0.2 to 1.0 mm.

9. The method for heightening a flash lamp device according to claim 1, characterized in that: The material of the wire support (2) is copper or copper alloy and the thickness of the wire support (2) is 0.1 to 0.5 mm.

10. The method for heightening a flash lamp device according to claim 1, characterized in that: The white glue I (7) and white glue II (8) are both made of EMC / SMC material.

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