Machining method for high-precision metal circuit on surface of composite material

Abstract

The invention relates to the technical field of circuit manufacturing, in particular to a method for processing a high-precision metal circuit on the surface of a composite material, which comprises the following steps of: paving an adhesive film with a light-induced activation effect on the surface of a composite material workpiece; carrying out curing treatment on the composite material workpiece on which the adhesive film paving is completed; carrying out laser induced activation on the surface of the cured composite material workpiece by adopting laser processing; and carrying out surface metal coating on the laser-induced and activated composite material workpiece to prepare the high-precision metal circuit on the surface of the composite material. The processing method of the high-precision metal circuit on the surface of the composite material aims to solve the problem that the conductivity and precision of the metal circuit processed on the surface of the composite material through laser direct writing are low.

Description

Technical Field

[0001] The invention relates to the technical field of circuit manufacturing, and in particular to a method for processing high-precision metal circuits on the surface of a composite material. Background Art

[0002] Composite parts often have metal circuits prepared on the surface to achieve various functions, such as lightning protection, frequency selection, conformal sensing, etc. The most common manufacturing methods currently include screen printing, copper foil or metal-containing circuit film, laser direct writing, etc. The precision required for screen printing of conductive ink is relatively low, and a separate mold needs to be opened for printing. In addition, since composite materials are not heat-resistant and cannot withstand high sintering temperatures, the conductivity of the printed metal circuits is not high. Copper foil or metal-containing circuit film is generally laid by hand, which is only suitable for developable surfaces or low-curvature non-developable surfaces, and it is easy to be uneven and wrinkled during laying, and the joints are easy to be uneven. The laser direct writing process uses a laser to etch directly on the polymer surface, which can cause carbonization or form graphene, but since the ablation width of the material after polymer carbonization is difficult to control, the minimum line width, minimum line spacing and accuracy of the formed circuit are poor. In addition, the circuit conductivity obtained by laser direct writing is low, and this process is not suitable for parts with high conductivity requirements for the circuit.

[0003] Therefore, the inventor provides a method for processing high-precision metal circuits on the surface of a composite material. Summary of the invention

[0004] (1) Technical issues to be solved

[0005] The embodiment of the present invention provides a method for processing high-precision metal circuits on the surface of a composite material, which solves the technical problem of low conductivity and low precision in processing metal circuits on the surface of a composite material by laser direct writing.

[0006] (2) Technical solution

[0007] The present invention provides a method for processing high-precision metal circuits on the surface of a composite material, comprising the following steps:

[0008] Laying a photoactivated adhesive film on the surface of a composite material product;

[0009] Curing the composite material parts after the film laying;

[0010] Laser processing is used to perform laser-induced activation on the surface of the cured composite material part;

[0011] The surface of the composite material product after laser induced activation is subjected to metal plating to prepare a high-precision metal circuit on the surface of the composite material;

[0012] Among them, additives with photoactivation effect are added to the adhesive film, and the additives include a coating matrix, a solvent / dispersant, an LDS additive and an auxiliary agent. The coating matrix is ​​a resin matrix or a ceramic matrix; the weight of the coating matrix is ​​30 to 98 parts, the weight of the solvent / dispersant is 0 to 70 parts, the weight of the LDS additive is 1 to 30 parts, and the weight of the auxiliary agent is 0 to 30 parts.

[0013] Furthermore, the adhesive film includes an epoxy adhesive film and a bismaleimide adhesive film.

[0014] Furthermore, the composite material part after the film paving is subjected to curing treatment, specifically:

[0015] The composite material product is sent into an oven / autoclave and a curing process is set according to the type of film.

[0016] Furthermore, after curing the composite material part after the adhesive film is laid, the method further includes: performing surface pretreatment on the composite material part.

[0017] Furthermore, the pre-treatment method includes at least one of grinding, sandblasting, solvent cleaning, chemical etching, flame treatment, corona discharge and plasma surface treatment.

[0018] Furthermore, the laser processing uses a pulsed laser.

[0019] Furthermore, the central wavelength of the light source of the pulse laser is 355-1064 nm.

[0020] Furthermore, the output power of the pulse laser is 0.1-100w.

[0021] Furthermore, the process of performing metal plating on the surface of the composite material after laser induced activation to prepare a high-precision metal circuit on the surface of the composite material specifically includes the following steps:

[0022] Cleaning the surface of the composite material part;

[0023] The cleaned composite material workpiece is placed in a pre-plating metal plating tank for surface metal plating;

[0024] Clean the surface of composite parts after metal plating.

[0025] Furthermore, laser etching is used to perform fine processing on the edge of the metal circuit / pattern.

[0026] (3) Beneficial effects

[0027] In summary, the present invention lays a special adhesive film on the surface of a composite material workpiece to make it have the property of being laser activated and to process the high-precision circuits through adhesive film curing, laser processing and chemical plating / electroplating metallization process. At the same time, by combining various processes of the composite material and the new special adhesive film material, the composite material body has the property of being plated, and combined with the non-contact, high-precision laser processing process, a new method is provided for preparing high-precision metal circuits on the surface of the composite material. Since the adhesive film material and the composite material have strong interlayer bonding force, the laser processing process activates and roughens the surface of the material, which can significantly improve the bonding force between heterogeneous metal circuits and composite plates. Laser processing only acts on the surface and the composite material, and does not affect the mechanical properties of the composite material component body. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic flow chart of a method for processing high-precision metal circuits on the surface of a composite material provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The following detailed description of the embodiments of the present invention is provided in conjunction with the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0031] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the products of the present invention are conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] Figure 1 is a schematic diagram of a process for processing a high-precision metal circuit on a composite material surface provided by an embodiment of the present invention, see Figure 1, the method may include the following steps:

[0034] S100, laying a photoactivated adhesive film on the surface of the composite material product.

[0035] Specifically, a layer of laser-activated material is added in situ on the surface of the composite material by using the adhesive film paving method, which does not affect the mechanical properties of the composite material matrix itself. The paving method is a traditional manufacturing process method for composite materials. The manufacturing technology on the surface of composite materials is relatively mature, and the paving surface effect is excellent. At the same time, paving the adhesive film can improve the roughness of the composite material surface, which is conducive to the next step of precision laser processing. The adhesive film is paved on the surface of the composite material. Depending on the type of composite material, an adhesive film with good adhesion to the composite material should be selected. For example, for epoxy / carbon fiber composite materials, epoxy adhesive film is often used, and for bismaleimide resin / carbon fiber composite materials, bismaleimide adhesive film is often used. In order to further enhance the bonding force between the special functional adhesive film and the composite material board, the composite material is often surface treated, such as polishing, roughening, etc. The paving construction method depends on the shape and size of the composite material workpiece, and manual paving and automatic paving are often used.

[0036] Additives with photoactivation effect are added to the film, and the additives include a coating matrix, a solvent / dispersant, an LDS additive and an auxiliary agent. The coating matrix is ​​a resin matrix or a ceramic matrix; the weight of the coating matrix is ​​30 to 98 parts, the weight of the solvent / dispersant is 0 to 70 parts, the weight of the LDS additive is 1 to 30 parts, and the weight of the auxiliary agent is 0 to 30 parts. According to the different materials of the target parts, it can be roughly divided into organic thermosetting coatings and inorganic ceramic coatings. Organic thermosetting coatings are suitable for bonding with the surface of composite materials, and inorganic ceramic coatings are suitable for bonding with ceramic surfaces. The LDS process is extended to more materials, such as composite materials, ceramic materials, etc., which expands the application scope and application scenarios of the LDS process (laser engraving-chemical plating) for preparing patterned conductive circuits. Since the LDS additive is not added to the base material, the base performance will not be lost, especially the mechanical properties, dielectric properties and other aspects. At the same time, the surface roughness of the substrate is improved by the LDS coating method, and the problem of low circuit accuracy caused by the rough surface of the substrate in the chemical plating process is overcome. Among them, the coating matrix content affects the adhesion to the substrate, the solvent / dispersant content determines the viscosity of the finished coating and affects the construction performance, and the LDS additive content affects the plating of metal circuits in subsequent processes and the precision and quality of the finished product. It is necessary to comprehensively consider the content of each component in the formula and regulate the coating performance as a whole.

[0037] Among them, the solvent or dispersant is mainly selected according to the resin or ceramic matrix system, and can be water, aliphatic hydrocarbons, alicyclic hydrocarbons, such as naphtha, solvent oil; rosin water aromatic hydrocarbons, such as toluene, xylene and high flash point aromatic oil; ketones, esters, such as methyl ethyl ketone (MEK), methyl isobutyl ketone, isophorone, propylene glycol methyl ether acetate, ether acetate, butanone, acetone, cyclohexanone; ethers such as ethylene glycol ethyl ether, ethylene glycol monobutyl ether, propylene glycol propyl ether, ethylene glycol monobutyl ether; alcohols, such as methanol, ethanol, isopropanol, n-butanol, sec-butanol, isobutanol, isooctyl alcohol, cyclohexanol, etc.

[0038] LDS additives are used to activate the reaction during the laser engraving process, thereby achieving selective chemical plating (chemical deposition). They are usually metal salts of copper or tin, such as copper chromite (copper chrome black), copper hydroxyphosphate (basic copper phosphate), arsenic trioxide, tin dioxide, etc.

[0039] The additives can be leveling agents, defoamers, drying agents, anti-skinning agents, anti-settling agents, antioxidants, mildew inhibitors, curing agents, accelerators, plasticizers, slow-release agents, rust removers, foaming agents, photosensitizers, tackifiers, coupling agents. The additives here can also be powders, particles, microbeads, fibers added to improve the performance of the coating, such as continuous or chopped fibers, organic fibers, inorganic fibers or metal wires, including carbon fibers, glass fibers, quartz fibers, mullite fibers, basalt fibers, lignin fibers, natural fibers, carbon nanotube fibers, ceramic fibers, boron fibers, aramid fibers, Kevlar fibers, ultra-high molecular weight polyethylene fibers, liquid crystal polymers (LCP), optical fibers, polyaryletherketone fibers, nylon fibers, polyimide fibers , such as polymer powder, polytetrafluoroethylene powder, liquid crystal polymer powder, glass beads, ceramic beads, carbon nanotubes, graphene, alumina (corundum), zinc oxide, titanium dioxide, mullite, calcium carbonate, magnesium carbonate, calcium silicate, aluminum silicate, magnesium silicate, potassium aluminum silicate, barium sulfate, silicon carbide, silicon nitride, boron nitride, silicon dioxide, whiskers, zirconium dioxide, yttrium dioxide, tungsten sulfide, adamantane, montmorillonite, nanosilver, cage-type polyhedral oligomeric silsesquioxane (POSS), MXene, ferrite, toner, etc.

[0040] Due to the high viscosity of high temperature resistant coatings, it is necessary to add certain additives to improve the coating's workability. Since laser processing is required on the coating surface later, in order to ensure processing accuracy, it is necessary to add certain additives to improve the hardness and mechanical properties of the coating after curing.

[0041] As an optional embodiment, the resin matrix is ​​any one of a polymer, a monomer that can generate a polymer, an oligomer and a prepolymer. Further, a suitable resin matrix is ​​selected according to the surface of the adapted part, such as an organosilicon resin, an organic fluorine coating, an organic titanium coating, a polysiloxane, a polysiloxane, a polysilazane, a polysilane, and a polysilocarbon. The resin matrix includes at least one of epoxy resin, bismaleimide resin, cyanate resin, polyimide resin, polyurethane, hydroxy polyether, urea-formaldehyde resin, polysiloxane, polysilazane, polysilane, polysilocarbon, modified epoxy resin, phenolic resin, benzoxazine resin and melamine formaldehyde resin. The resin matrix also includes at least one of polyether sulfone ketone, polyether ether ketone, polyarylether ketone, polyether sulfone, polysulfone, polyimide ether, polycarbonate, polyphenylene ether and liquid crystal polymer. The high temperature resistant resin matrix usually has an aromatic or silicone-containing molecular structure, which usually exhibits high viscosity, high molecular polarity, and poor compatibility with solvents / dispersants, which is specifically manifested in poor coating construction properties.

[0042] It should be noted here that the selection of the resin matrix is ​​determined according to the subsequent processing steps of the substrate and the type of substrate. The subsequent processing steps of the substrate refer to whether the surface needs to be further encapsulated, whether the substrate needs to be sprayed with other materials again, whether the substrate needs to be further bonded, etc. after the LDS process manufacturing line. The type of substrate refers to the service environment of the substrate, the adhesion between the substrate and the coating, etc. For composite material substrates, the same resin matrix is ​​preferably used as the coating resin matrix to improve the adhesion between the coating and the substrate. For example, for bismaleimide resin prepreg composite material substrates, it is suitable for coating matrices with bismaleimide monomer (BMI) and its oligomer prepolymer as the main component. In order to ensure the toughness of the coating, toughening agents or toughening curing agents are often added to the bismaleimide resin material. Diamines, bisphenols, epoxy, thermoplastic resins and other materials are often selected to improve the performance of the coating resin matrix. The composite material substrate prepared from cyanate resin prepreg is suitable for coating matrix with cyanate resin and its oligomer prepolymer as the main component. Depending on the application scenarios of the coating, different types of cyanate resins can be selected to adjust the heat resistance, glass transition temperature, dielectric constant, dielectric loss and other properties. Preferably, the cyanate resin is bisphenol A cyanate monomer, bisphenol A cyanate prepolymer, dicyclopentadiene cyanate, dicyclopentadiene cyanate prepolymer, phenolic cyanate monomer, phenolic cyanate monomer, etc. For thermoplastic composite material substrates, such as polyetheretherketone composite materials, polyaryletherketone composite materials, polyetherimide composite materials, polyphenylene sulfide composite materials, polyarylate composite materials, polyimide composite materials, liquid crystal elastomer composite materials, polyethersulfone composite materials, polyethersulfoneketone composite materials, etc., one or more of organic silicone resin, polyimide resin, phenolic resin and other resins are often used as the coating matrix.

[0043] As an optional embodiment, the ceramic matrix includes at least one of an inorganic-organic composite matrix composed of a metal oxide, a non-metallic oxide, and an organic silicon resin. Specifically, the ceramic matrix is ​​mainly an inorganic-organic composite matrix composed of a metal oxide or a non-metallic oxide or a small amount of an organic silicon resin, such as a hydrolyzate or hydrolyzate oligomer of elements such as silicon, aluminum, titanium, zirconium, molybdenum, cerium, and iridium, including ethyl silicate, silicate, silica sol, or silicon, aluminum, titanium, zirconium, molybdenum, cerium, iridium, and other element oxide powder materials. It should be noted that for ceramic substrates, the same material or the same element ceramic is often used as a coating substrate. In order to regulate adhesion, silicone resins, epoxy resins, etc. are often compounded therein.

[0044] As an optional embodiment, the LDS additive is a metal salt of copper, arsenic or tin. The LDS additive includes at least one of copper chromite, copper hydroxyphosphate, arsenic trioxide and tin dioxide.

[0045] Furthermore, the weight portion of the LDS additive is 3 to 10 parts.

[0046] S200, curing the composite material product after the film is laid.

[0047] Specifically, the composite material parts after the film is laid can be sent to a common oven or autoclave to set the curing program according to the type of film to complete the curing. In addition, the film can also be laid directly on the surface of the prepreg through co-curing, and then put into the autoclave together to complete the curing at one time.

[0048] S300, laser processing is used to perform laser-induced activation on the surface of the cured composite material part.

[0049] Specifically, the special additives in the special adhesive film have a photo-activated effect. The additives in the surface adhesive film are induced by laser with appropriate power to make it have a "seed" surface with chemical plating / electroplating activity. The surface of the composite material is selectively laser-induced activated by laser processing. The workpiece can be a flat surface or a curved surface. The surface of the composite material with the special adhesive film is processed according to the metallized circuit drawing. Among them, the selected laser is a pulsed laser, preferably a nano, picosecond or femtosecond laser, which is generally transmitted by optical fiber or hard optical path. The central wavelength of the light source is 355 to 1064nm, preferably 532nm or 1064nm; the processing system is generally a field lens or an objective lens, wherein the field lens can also be used with a two-dimensional or three-dimensional galvanometer; the output power of the laser processing is generally between 0.1 and 100w, preferably 1 to 5w.

[0050] S400, performing metal plating on the surface of the composite material workpiece after laser induced activation to prepare a high-precision metal circuit on the surface of the composite material.

[0051] Specifically, the obtained composite material parts are cleaned by ultrasonic cleaning to remove surface dust, grease, etc. Then, the composite material parts are placed in a pre-copper plating tank, and a suitable plating method is selected. If electroplating is selected, the surface must be connected to electricity, and the laser-activated patterned copper is plated. The copper layer can reach a specified thickness. The electroplating time depends on the designed copper layer thickness, and the parts are taken out every half an hour for copper thickness testing. The metal circuit obtained by the present invention has a strong bonding force with the surface of the composite material, and the adhesion can reach level 0 by using the cross-hatch method (GB / T 9286-2021) to test the adhesion.

[0052] Furthermore, according to the accuracy requirements of the metal circuit of the part, a laser can be used to perform fine processing on the metal-plated circuit according to the instruction drawing, and the laser etching removal method can be used on the edge of the metal circuit / pattern to improve the accuracy of the circuit edge.

[0053] As an optional implementation, after step S200, curing the composite material part after the adhesive film is laid, the method further includes: performing surface pretreatment on the composite material part.

[0054] Specifically, depending on the different parts to be processed, you can choose to pre-treat the surface of the parts, and some parts do not need pre-treatment. The pre-treatment process mainly treats the surface of the parts, and the methods include one or more of grinding, sandblasting, solvent cleaning, chemical etching, flame treatment, corona discharge, plasma surface treatment, etc.

[0055] As an optional implementation, step S400, performing metal plating on the surface of the composite material workpiece after laser induced activation to prepare a high-precision metal circuit on the surface of the composite material, specifically includes the following steps:

[0056] S401, cleaning the surface of the composite material parts;

[0057] S402, placing the cleaned composite material workpiece into a pre-plating metal plating tank for surface metal plating;

[0058] S403, cleaning the surface of the composite material part after the metal coating is completed.

[0059] The present invention can be used to prepare two-dimensional or three-dimensional high-precision patterned circuits on the surface of composite materials by laser engraving-plating, so as to realize the manufacturing of high-bonding force circuits and conformal circuits on the surface of composite materials. At the same time, due to the strong design of laser processing, low-cost patterned manufacturing is realized. The processing method of the present invention does not affect the mechanical properties and electromagnetic properties of the composite materials themselves.

[0060] Example 1

[0061] Step 1: Polish the surface of the bismaleimide resin / quartz fiber composite parts with sandpaper and wipe them thoroughly with acetone. Place the parts on the preheated tooling, and lay the special bismaleimide functional film on the surface of the composite material to ensure that there are no bubbles. Use a vacuum bag to fully compact it.

[0062] Step 2: Place the composite board with the vacuum bag obtained in step 1 into an oven and bake at 180° C. for 4 hours to cure the adhesive film.

[0063] Step 3: The composite plate obtained in step 2 is laser activated on the composite surface by using a nano laser through an optical fiber and a three-dimensional galvanometer processing head according to the drawing. The central wavelength of the light source is 1064nm and the output power is 5w. In order to realize three-dimensional circuit manufacturing, a five-axis machine tool is selected to expand the processing range of the processing head.

[0064] Step 4: ultrasonically clean the composite board obtained in step 3 in deionized water for 20 minutes. Then transfer it to the pre-copper plating tank, perform chemical plating at 55°C for 15 minutes, and use a blower to introduce air for stirring. Then transfer it to the chemical thick copper tank, perform chemical plating at 50°C for 1 hour, and use a blower to introduce air for stirring. After the chemical plating is completed, use deionized water to fully clean the surface of the composite board, and after drying, perform anti-oxidation encapsulation on the circuit surface.

[0065] Example 2

[0066] Step 1: Use cyanate ester / glass fiber prepreg and manually lay it on the preheated tooling according to the drawing. Lay the top layer with cyanate ester special functional film to ensure that there are no bubbles in the laying and use a vacuum bag to fully compact it.

[0067] Step 2: Place the composite board with the vacuum bag obtained in step 1 into an autoclave and bake at 180° C. for 4 hours to cure the adhesive film.

[0068] Step 3: The composite plate obtained in step 2 is laser activated on the surface of the composite material according to the drawing using a femtosecond laser through a hard optical path and a three-dimensional galvanometer processing head. The central wavelength of the light source is 1064nm and the output power is 7w.

[0069] Step 4: ultrasonically clean the composite board obtained in step 3 in deionized water for 20 minutes. Transfer to the pre-copper plating tank, perform chemical plating at 60°C for 15 minutes, and use a blower to introduce air for stirring. Transfer to the chemical thick copper tank, perform chemical plating at 55°C for 30 minutes, and use a blower to introduce air for stirring. Subsequently, the surface three-proof treatment is completed by surface chemical nickel plating and chemical silver plating.

[0070] Example 3

[0071] Step 4: Sand the surface of the epoxy resin / hollow fiber composite parts with sandpaper and wipe them thoroughly with butanone. Place the parts on the preheated tooling, and lay the special epoxy resin functional film on the surface of the composite material to ensure that there are no bubbles. Use a vacuum bag to fully compact it.

[0072] Step 2: Place the composite board with the vacuum bag obtained in step 1 into an autoclave and bake at 130° C. for 3 hours to cure the adhesive film.

[0073] Step 3: Perform plasma surface cleaning on the parts.

[0074] Step 4: The composite parts obtained in step 3 are laser activated on the composite surface using a nano laser through an optical fiber and a three-dimensional galvanometer processing head according to the drawing. The central wavelength of the light source is 355nm and the output power is 5w. In order to realize three-dimensional circuit manufacturing, a five-axis machine tool is selected to expand the processing range of the processing head.

[0075] The composite parts obtained in step 4 were ultrasonically cleaned in deionized water for 20 minutes. The surface of the parts was electrified and then transferred to a copper electroplating tank for electroplating at 55° C. for 60 minutes.

[0076] It should be clear that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. The present invention is not limited to the specific steps and structures described above and shown in the figures. In addition, for the sake of brevity, a detailed description of known methods and technologies is omitted here.

[0077] The above are only embodiments of the present application and are not limited to the present application. For those skilled in the art, the present application may have various changes and variations without departing from the scope of the present invention. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A method for processing high-precision metal circuits on the surface of a composite material, characterized in that: The method comprises the following steps: Laying a photoactivated adhesive film on the surface of a composite material product; Curing the composite material parts after the film laying; Laser processing is used to perform laser-induced activation on the surface of the cured composite material part; The surface of the composite material product after laser induced activation is subjected to metal plating to prepare a high-precision metal circuit on the surface of the composite material; Among them, additives with photoactivation effect are added to the adhesive film, and the additives include a coating matrix, a solvent / dispersant, an LDS additive and an auxiliary agent. The coating matrix is ​​a resin matrix or a ceramic matrix; the weight of the coating matrix is ​​30 to 98 parts, the weight of the solvent / dispersant is 0 to 70 parts, the weight of the LDS additive is 1 to 30 parts, and the weight of the auxiliary agent is 0 to 30 parts.

2. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: The adhesive film includes epoxy adhesive film and bismaleimide adhesive film.

3. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: The composite material product after the film paving is subjected to curing treatment, specifically: The composite material product is sent into an oven / autoclave and a curing process is set according to the type of film.

4. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: After curing the composite material product after the adhesive film is laid, the method further includes: performing surface pretreatment on the composite material product.

5. The method for processing high-precision metal circuits on the surface of a composite material according to claim 4, characterized in that: The pre-treatment method includes at least one of grinding, sandblasting, solvent cleaning, chemical etching, flame treatment, corona discharge and plasma surface treatment.

6. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: Laser processing uses pulsed lasers.

7. The method for processing high-precision metal circuits on the surface of a composite material according to claim 6, characterized in that: The central wavelength of the light source of the pulse laser is 355-1064nm.

8. The method for processing high-precision metal circuits on the surface of a composite material according to claim 6, characterized in that: The output power of the pulse laser is 0.1-100w.

9. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: The method of performing metal plating on the surface of the composite material product after laser induced activation to prepare a high-precision metal circuit on the surface of the composite material specifically includes the following steps: Cleaning the surface of the composite material part; The cleaned composite material workpiece is placed in a pre-plating metal plating tank for surface metal plating; Clean the surface of composite parts after metal plating.

10. The method for processing high-precision metal circuits on the surface of a composite material according to claim 1, characterized in that: Laser etching is used to fine-tune the edges of metal lines / patterns.

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