Micro-channel liquid cooling radiator

Abstract

The invention provides a micro-channel liquid cooling radiator which comprises a liquid cooling plate body, a cavity for a liquid working medium to flow is formed in the liquid cooling plate body, the cavity comprises a first micro-channel area and a second micro-channel area which are separated from each other, a communicating cavity is further formed in the cavity, and the first micro-channel area is communicated with the second micro-channel area. The communicating cavity is communicated with a micro-channel outlet of the first micro-channel area and a micro-channel inlet of the second micro-channel area, so that a liquid working medium flowing out of the first micro-channel area enters the second micro-channel area through the communicating cavity. In the micro-channel liquid cooling radiator, the first micro-channel area and the second micro-channel area can be designed according to heat source distribution characteristics, the first micro-channel area is used for cooling a main heat source or a heat source high heating area preferentially, and the second micro-channel area is used for cooling a secondary heat source or a heat source low heating area. Therefore, the maximum temperature and temperature uniformity of the main heat source, the secondary heat source, the source high-heating area and the heat source low-heating area are effectively controlled, and chip computing power maximization is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of radiators, and in particular to a microchannel liquid-cooled radiator. Background Art

[0002] As the heat flux density of electronic products gradually increases, temperature control becomes more and more difficult. Heat dissipation and temperature control technology have become key issues restricting the development of electronic products. How to use existing mature heat dissipation technology to control the junction temperature and temperature uniformity of electronic devices is particularly important.

[0003] In the process of implementing the present invention, the inventors found that there are at least the following technical problems in the prior art:

[0004] The conventional straight channel design makes the fluid temperature gradually increase along the flow direction, so the temperature of the heat source surface gradually increases, and the temperature difference is large. In addition, the functional complexity of electronic products has led to more and more heat sources integrated into a single chip and more and more complex layouts. It is particularly important to control the temperature uniformity of different areas of the same heat source or the temperature uniformity of different heat sources of the integrated heat source to maximize computing power. Therefore, how to reasonably design the heat sink to achieve high-temperature uniform heat dissipation still faces huge challenges. Summary of the invention

[0005] In view of this, the present application proposes a microchannel liquid-cooled radiator that can achieve high-temperature uniform heat dissipation.

[0006] To achieve the above objectives, the present application provides a microchannel liquid-cooled radiator, comprising a liquid-cooled plate body, wherein a cavity for liquid working medium to flow is formed inside the liquid-cooled plate body, wherein the cavity comprises a first microchannel area and a second microchannel area separated from each other, and a connecting cavity is also provided in the cavity, wherein the connecting cavity connects the microchannel outlet of the first microchannel area and the microchannel inlet of the second microchannel area, so that the liquid working medium flowing out of the first microchannel area enters the second microchannel area via the connecting cavity.

[0007] In one embodiment, the first microchannel area, the connecting cavity and the second microchannel area are located at the same height layer, and the liquid working medium flows from the middle of the first microchannel area into each microchannel of the first microchannel area.

[0008] In one embodiment, the channel width of the connecting cavity gradually decreases from the first microchannel area to the second microchannel area.

[0009] In one embodiment, the cavity also includes an inlet diversion cavity for liquid working medium to enter the first microchannel area; along the flow direction of the liquid working medium, the inlet section of the inlet diversion cavity gradually expands relative to the outlet section in the width direction of the first microchannel area, and the inlet section of the inlet diversion cavity gradually decreases relative to the outlet section in the width direction perpendicular to the first microchannel area.

[0010] In one embodiment, the outlet section of the inlet diversion chamber is connected from above to the midpoint of the microchannel of the first microchannel zone.

[0011] In one embodiment, the first microchannel zone is provided with a connecting channel in the flow direction, and the connecting channel is provided along the width direction of the first microchannel zone and connects the microchannels in the width direction.

[0012] In one embodiment, it further includes an inlet joint, an outlet joint and a liquid cooling plate body, wherein the inlet joint and the outlet joint are vertically arranged on the first surface of the liquid cooling plate body, and the second surface of the liquid cooling plate body opposite to the first surface is used to contact the heat source; an inlet channel connected to the cavity is formed in the inlet joint, and an outlet channel connected to the cavity is formed in the outlet joint.

[0013] In one embodiment, the chamber includes an inlet diversion chamber, the first microchannel area, the connecting chamber, the second microchannel area, an outlet confluence chamber and an outlet buffer chamber in sequence from the flow direction of the liquid working medium; the inlet diversion chamber is connected to the inlet channel, and the outlet buffer chamber is connected to the outlet channel.

[0014] In one embodiment, the second microchannel area is provided on both sides of the width direction of the first microchannel area respectively; the microchannel outlet of each second microchannel area is connected to the outlet confluence chamber, and the liquid working medium in the two outlet confluence chambers converges in the outlet buffer chamber.

[0015] In one embodiment, a radiator cover plate and a radiator base plate are included, wherein the radiator cover plate and the radiator base plate are connected to form a whole;

[0016] The radiator cover plate comprises a cover body, the inlet joint and the outlet joint are arranged on the top surface of the cover body; the inlet flow dividing cavity, the outlet flow converging cavity and the outlet buffer cavity are respectively formed in the upper layer inside the cover body, and the bottom cavity is formed in the lower layer inside the cover body;

[0017] The heat sink substrate comprises a bottom plate, a first fin group and a second fin group, wherein the first fin group and the second fin group are formed on an upper surface of the bottom plate;

[0018] The bottom surface of the cover body is assembled with the upper surface of the bottom plate, and the first fin group and the second fin group are embedded in the bottom cavity, so that the first fin group forms the first microchannel area, the second fin group forms the second microchannel area, and the connecting cavity is formed next to the first fin group and the second fin group.

[0019] The microchannel liquid-cooled radiator provided in the present application has the following beneficial effects: in the microchannel liquid-cooled radiator of the present application, the first microchannel area and the second microchannel area can be designed in combination with the heat source (integrating multiple heat sources or different areas of the heat source have large differences in heat generation), the first microchannel area is used to preferentially cool the main heat source or the high heat generation area of ​​the heat source with large thermal power and heat flux density, and the second microchannel area is used to cool the secondary heat source or the low heat generation area of ​​the heat source, and the low-temperature liquid working fluid first enters the first microchannel area to cool the main heat source or the high heat generation area of ​​the heat source, thereby effectively controlling the maximum temperature and temperature uniformity of the main heat source and the secondary heat source, the high heat generation area of ​​the heat source and the low heat generation area of ​​the heat source, thereby maximizing the computing power of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a microchannel liquid cooling radiator provided in one embodiment of the present application;

[0021] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure of the microchannel liquid cooling radiator in contact with the heat source;

[0022] Figure 3 for Figure 1 A schematic diagram of the top view of the microchannel liquid cooling radiator;

[0023] Figure 4 For along Figure 3 Schematic diagram of the cross-sectional structure in the AA direction;

[0024] Figure 5 The edge after rotating 90° counterclockwise Figure 3 Schematic diagram of the cross-sectional structure in the middle BB direction;

[0025] Figure 6 The edge after rotating 90° counterclockwise Figure 3 Schematic diagram of the cross-sectional structure in the CC direction;

[0026] Figure 7 for Figure 1 A schematic diagram of the main structure of the microchannel liquid cooling radiator;

[0027] Figure 8 For along Figure 7 Schematic diagram of the cross-sectional structure in the middle DD direction;

[0028] Fig. 9For along Figure 7 Schematic diagram of the cross-sectional structure in the EE direction;

[0029] Fig.10 For along Figure 7 Schematic diagram of the cross-sectional structure in the FF direction;

[0030] Fig.11 for Figure 1 The right side structural diagram of the microchannel liquid cooling radiator in FIG.

[0031] Fig.12 For along Fig.11 Schematic diagram of the three-dimensional structure after sectioning along the middle GG direction;

[0032] Fig.13 for Figure 2 Schematic diagram of the decomposed structure of the microchannel liquid cooling radiator and the heat source;

[0033] Fig.14 for Figure 2 A schematic diagram of the exploded structure of the microchannel liquid cooling radiator and the heat source from another angle;

[0034] Fig.15 for Fig.13 A three-dimensional perspective structural diagram of a radiator cover;

[0035] Fig.16 for Fig.15 A schematic diagram of the structure of the radiator cover plate viewed from above;

[0036] Fig.17 for Fig.13 An enlarged three-dimensional structural schematic diagram of a heat sink substrate;

[0037] Fig.18 for Fig.17 Schematic diagram of the top view structure of the radiator substrate.

[0038] The components in the figure are labeled as follows:

[0039] Microchannel liquid cooling radiator 100;

[0040] Inlet connector 110;

[0041] Entrance channel 111;

[0042] Outlet connector 120;

[0043] Exit channel 121;

[0044] Liquid cooling plate 130;

[0045] First surface 131, second surface 132; inlet flow dividing chamber 133; first microchannel area 134; connecting chamber 135; second microchannel area 136; outlet confluence chamber 137; outlet buffer chamber 138;

[0046] Radiator cover 200;

[0047] Cover body 210, bottom cavity 220, partition 230;

[0048] Radiator base plate 300;

[0049] Bottom plate 310, first fin set 320, second fin set 330, isolation gap 340;

[0050] A first fin unit 321 and a connecting channel 322;

[0051] Heat source 900;

[0052] Primary heat source 910 and secondary heat source 920. DETAILED DESCRIPTION

[0053] Before describing the embodiments in detail, it should be understood that the present application is not limited to the detailed structure or component arrangement described below or in the drawings in the present application. The present application may be an embodiment implemented in other ways. Moreover, it should be understood that the words and terms used herein are only used for descriptive purposes and should not be interpreted restrictively. The words "including", "comprising", "having" and the like used herein are meant to include the items listed thereafter, their equivalents and other additional items. In particular, when describing "a certain element", the present application does not limit the number of the element to one, but may also include multiple elements.

[0054] See also Figure 1 and Figure 2The microchannel liquid cooling radiator 100 of an embodiment of the present application includes an inlet joint 110, an outlet joint 120 and a liquid cooling plate 130. The inlet joint 110 and the outlet joint 120 are connected to the first surface 131 (top surface) of the liquid cooling plate 130. The second surface 132 (bottom surface) of the liquid cooling plate 130 is a contact surface with a heat source 900 with a high heat flux density. The first surface 131 and the second surface 132 are two opposite outer surfaces on the liquid cooling plate 130. In the microchannel liquid cooling radiator 100, the liquid working medium enters the liquid cooling plate 130 from the inlet joint 110 of the liquid cooling plate 130 in a manner perpendicular to the first surface 131, contacts the heat source through the second surface 132, and then flows out of the liquid cooling plate 130 from the outlet joint 120 of the liquid cooling plate 130 in a manner perpendicular to the first surface 131. In the illustrated embodiment, the inlet joint 110 and the outlet joint 120 are located on the first surface 131 at the top of the liquid cooling plate 130, and the outlet joint 120 is in the middle of the first surface 131. The inlet joint 110 is arranged on one side of the outlet joint 120, and the liquid working medium enters and exits from the top.

[0055] Please refer to Figures 3 to 6 The inlet joint 110 and the outlet joint 120 are both hollow structures. The hollowness of the inlet joint 110 forms an inlet channel 111 from top to bottom, and the hollowness of the outlet joint 120 forms an outlet channel 121 from bottom to top. A cavity is formed inside the liquid cooling plate 130 for the liquid medium to flow in from the inlet channel 111 and out through the outlet channel 121. From the flow direction of the liquid medium (as shown by the arrow in the figure), the inlet diversion cavity 133, the first microchannel area 134, the connecting cavity 135, the second microchannel area 136, the outlet confluence cavity 137 and the outlet buffer cavity 138 are sequentially included.

[0056] The upper end of the inlet flow-dividing chamber 133 is connected to the lower end of the inlet channel 111, so that the liquid medium flows downward from the inlet channel 111 into the inlet flow-dividing chamber 133. The lower end of the inlet flow-dividing chamber 133 is connected to the first microchannel area 134, so that the liquid medium enters the microchannel of the first microchannel area 134 after being diverted by the inlet flow-dividing chamber 133.

[0057] Please refer to Figures 7 to 9 , the cross-sectional shape of the inlet section of the upper part of the inlet diverter cavity 133 perpendicular to the flow direction of the liquid medium is circular, and has the same diameter as the inlet channel 111; along the flow direction of the liquid medium, the cross-sectional shape of the outlet section of the lower part of the inlet diverter cavity 133 perpendicular to the flow direction of the liquid medium is gradually increasing in one direction and gradually decreasing in another perpendicular direction. Specifically, along the flow direction of the liquid medium, the inlet diverter cavity 133 gradually expands downward from the circular inlet section to the width direction of the entire first microchannel area 134, as shown in FIG. Figure 5Along the flow direction of the liquid working medium, the inlet flow diversion cavity 133 gradually shrinks downward from the circular inlet section in the direction perpendicular to the width of the first microchannel area 134, as shown in FIG. Figure 4 More specifically, in the illustrated embodiment, the cross-sectional shape of the outlet section of the inlet flow dividing chamber 133 perpendicular to the flow direction of the liquid medium is nearly octagonal, and the octagon is large in one direction (the width direction of the first microchannel area 134) and small in both sides of the direction (perpendicular to the width direction of the first microchannel area 134).

[0058] It should be noted that the outlet section of the inlet flow diversion chamber 133 may be in other polygonal shapes in the cross section perpendicular to the flow direction of the liquid medium, with the polygon having a large size in the middle and small sizes on both sides and a width less than or equal to the diameter of the circular inlet section. The projection of the outlet section of the inlet flow diversion chamber 133 on the horizontal plane is not limited to a polygon, and any shape structure that satisfies the connection of the inlet section and the outlet section through a structure of gradual expansion (in the width direction of the first microchannel area 134) and contraction (perpendicular to the width direction of the first microchannel area 134) is acceptable, and is not limited here.

[0059] The design of the inlet diverter chamber 133 can achieve the following effects: due to the heat accumulation effect, the center temperature of the heat source 900 is higher than the edge temperature, and the liquid working medium enters the first microchannel area 134 from the inlet channel 111 at the center through the inlet diverter chamber 133, which reduces the flow of the liquid working medium and is beneficial to reducing the maximum temperature and center temperature of the heat source; the polygonal design of the outlet section of the inlet diverter chamber 133, which is wide in the middle and narrow on both sides, makes the flow rate of the microchannel in the middle of the first microchannel area 134 greater than the flow rate of the microchannels on both sides, effectively realizing the on-demand distribution of the liquid working medium, thereby further reducing the maximum temperature of the heat source and improving the temperature uniformity of the heat source surface. The gradually widening design of the inlet diverter chamber 133 along the width direction of the first microchannel area 134 is conducive to the divergence of the liquid working medium after entering the inlet diverter chamber 133, so that the liquid working medium can enter each microchannel of the first microchannel area 134 to avoid local high temperature; the gradually narrowing design of the inlet diverter chamber 133 along the flow direction of the liquid working medium in another direction perpendicular to the width direction of the first microchannel area 134 makes the flow velocity of the liquid working medium gradually increase, and after entering the first microchannel area 134, a high-speed impact is formed and then a jet is formed, the local flow velocity of the liquid working medium is increased, the heat transfer coefficient at the center position is improved, and it is conducive to enhancing heat exchange.

[0060] Please refer to Fig.10The first microchannel area 134, the connecting cavity 135 and the second microchannel area 136 are distributed on the same height layer (microchannel flow layer); wherein the second microchannel area 136 is arranged on both sides of the channel width direction of the first microchannel area 134, and the second microchannel areas 136 on both sides are separated from the first microchannel area 134; the connecting cavity 135 connects the outlet of the microchannel of the middle first microchannel area 134 with the inlet of the microchannel of the second microchannel areas 136 on both sides in the flow direction of the liquid working medium.

[0061] In the first microchannel area 134, the liquid medium enters each microchannel from the midpoint of the microchannel and flows from the midpoint to both ends; a plurality of connecting channels ( Fig.17 and Fig.18 Each connecting channel is arranged along the width direction and connects the microchannels in the width direction of the channel, so that the flow and thermal boundary layer can be interrupted, which is beneficial to enhance heat exchange.

[0062] The connecting cavity 135 is inclined from the first microchannel area 134 to the second microchannel area 136, and the channel width gradually shrinks. Fig.10 The design of the connecting cavity 135 can bring the following effects: the design of the gradually contracting flow channel of the connecting cavity 135 can be used as a diversion structure of the second microchannel area 136, and the flow rate of each microchannel entering the second microchannel area 136 is made uniform by adjusting the inclination angle, thereby effectively controlling the temperature difference of the heat source (secondary heat source) corresponding to the second microchannel area 136 and improving the temperature uniformity.

[0063] After the liquid working medium is divided in the width direction of the first microchannel area 134 through the inlet diversion chamber 133 from the inlet channel 111 of the inlet joint 110, it enters the inflow microchannel flow layer from the first microchannel area 134. The outlet shape of the inlet diversion chamber 133 can divert the liquid working medium to each microchannel distributed in parallel in the width direction of the first microchannel area 134. The liquid working medium entering the first microchannel area 134 from the middle flows along the microchannel to both sides, flows out from the outlets on both sides into the connecting chamber 135, and then enters the second microchannel area 136.

[0064] The outlet confluence chamber 137 is disposed above the second microchannel region 136, and the upper portion of the middle portion of each second microchannel region 136 is connected to the lower end of the outlet confluence chamber 137, such as Figure 8 and Fig. 9 as shown in .

[0065] The outlet buffer chamber 138 is disposed above the outlet confluence chamber 137, connected to the upper ends of the outlet confluence chambers 137 on both sides, and connected to the lower end of the outlet channel 121. The liquid working medium flowing out of the microchannel flow layer flows upward through the two outlet confluence chambers 137, flows horizontally into the U-shaped outlet buffer chamber 138, and then flows out of the outlet joint 120.

[0066] Please refer to Fig.11 and Fig.12 The cavity inside the liquid cooling plate 130 of the microchannel liquid cooling radiator 100 can be divided into an upper inlet and outlet flow layer and a lower microchannel flow layer. The inlet flow dividing cavity 133, the outlet flow converging cavity 137 and the outlet buffer cavity 138 are located in the upper inlet flow layer; the first microchannel area 134, the connecting cavity 135 and the second microchannel area 136 are located in the microchannel flow layer.

[0067] The liquid working medium flows from the inlet channel 111 of the inlet joint 110 from top to bottom into the cavity of the liquid cooling plate body 130; the liquid working medium entering the internal cavity of the liquid cooling plate body 130 continues to flow from top to bottom, and flows into the microchannel flow layer after being diverted by the inlet diversion cavity 133; the diverted liquid working medium enters each microchannel of the first microchannel area 134; the liquid working medium entering each microchannel of the first microchannel area 134 exchanges heat with the heat source 900 corresponding to the first microchannel area 134 on the second surface 132, so as to cool down and dissipate heat for the heat source 900; the liquid working medium after heat exchange flows horizontally to the connecting cavity 135, and passes through the connecting cavity 13 5 enters the second microchannel area 136 on both sides of the first microchannel area 134; the liquid working medium in each microchannel of the second microchannel area 136 exchanges heat with the heat source 900 on the second surface 132 corresponding to the second microchannel area 136, cooling and dissipating the heat source 900; the liquid working medium in each microchannel of the second microchannel area 136 flows upward from the middle of the second microchannel area 136 through the outlet confluence chamber 137; the liquid working medium in the two outlet confluence chambers 137 continues to flow upward into the outlet buffer chamber 138 and merges in the outlet buffer chamber 138; the merged liquid working medium can flow out from bottom to top through the outlet channel 121. In this way, the microchannel liquid cooling radiator 100 completes a circulation process of the liquid working medium.

[0068] See also Fig.13 and Fig.14The microchannel liquid-cooled radiator 100 includes a radiator cover plate 200 and a radiator substrate 300. The radiator cover plate 200 and the radiator substrate 300 are assembled as a whole. The radiator cover plate 200 and the radiator substrate 300 are connected to form a whole through welding and other processes. The process is mature, the processing is convenient, and the cost is controllable. The heat source 900 is arranged on the bottom surface of the radiator substrate 300. The heat source 900 applicable to the microchannel liquid-cooled radiator 100 includes a main heat source 910 and a secondary heat source 920. More specifically, in the illustrated embodiment, the heat source 900 includes 1 main heat source 910 and 4 secondary heat sources 920. The heating power and heat source density of the main heat source 910 are much greater than the heating power and heat flux density of the secondary heat source 920. Therefore, the temperature control requirements of the main heat source 910 are higher than the temperature control requirements of the secondary heat source 920, including the maximum temperature and temperature uniformity. Based on the above heat source layout, the liquid working fluid of the microchannel liquid cooling radiator 100 cools the main heat source 910 first, and then cools the heat source 900 and the secondary heat source 920, thereby effectively controlling the maximum temperature and temperature uniformity of the main heat source 910 and the secondary heat source 920, and maximizing the chip computing power.

[0069] Please refer to Fig.15 and Fig.16 The radiator cover plate 200 includes a cover body 210, an inlet joint 110 and an outlet joint 120 are located at the top of the cover body 210, the inlet joint 110 is in the middle of the top surface (first surface 131) of the cover body 210, and the outlet joint 120 is arranged on one side of the outlet joint 120, and the liquid working medium enters the cavity of the liquid cooling plate body 130 from the top and flows out of the cavity from the top (in from the top and out from the top). In the illustrated embodiment, the inlet joint 110 and the outlet joint 120 are both cylindrically formed at the top of the cover body 210, and the outer diameter and inner diameter of the outlet joint 120 are equal to the outer diameter and inner diameter of the inlet joint 110.

[0070] The interior of the cover 210 is formed with an inlet flow-dividing chamber 133, an outlet flow-converging chamber 137 and an outlet buffer chamber 138 at the upper layer, and a bottom chamber 220 is formed at the lower layer. Two partitions 230 are respectively arranged in the cover 210 to separate the internal space of the cover 210. The upper part of the partition 230 extends into the upper layer to separate the inlet flow-dividing chamber 133 from the outlet flow-converging chambers 137 on both sides, and the lower part of the partition 230 separates the bottom chamber 220 and protrudes downward from the edge of the cover 210.

[0071] Please refer to Fig.17 and Fig.18, the heat sink substrate 300 includes a base plate 310, a first fin group 320 and a second fin group 330. The first fin group 320 and the second fin group 330 are formed on the upper surface of the base plate 310, and the two second fin groups 330 are spaced apart on both sides of the first fin group 320. The first fin group 320 includes a plurality of first fin units 321, each first fin unit 321 is provided with a plurality of parallel and spaced fins perpendicular to the base plate 310, and microchannels are formed between adjacent fins; connecting channels 322 are provided between adjacent first fin units 321, and the connecting channels 322 connect the microchannels of the two first fin units 321. The second fin group 330 is provided with a plurality of parallel and spaced fins perpendicular to the base plate 310, and microchannels are formed between adjacent fins. Among them, the microchannels of the first fin group 320 and the second fin group 330 have the same direction ( Fig.18 left-right direction as shown in ).

[0072] The bottom surface of the cover body 210 is the assembly surface, and the upper surface of the base plate 310 is the assembly surface. The assembly surfaces have the same size and have a positioning function during assembly. The two assembly surfaces are fitted (welded) and assembled to form the entirety of the microchannel liquid-cooled radiator 100.

[0073] There is an isolation gap 340 between the two second fin groups 330 and the first fin group 320, and the isolation gap 340 matches the lower part of the partition 230. In this way, when the radiator cover plate 200 is assembled on the radiator base plate 300, the lower part of the partition 230 extends into the isolation gap 340, and the lower edge is embedded in the bottom plate 310, so as to form a microchannel flow layer after assembly. More specifically, the partition 230 separates the first fin group 320 and the second fin groups 330 on both sides, forming the first microchannel area 134 and the second microchannel area 136 respectively; the first fin group 320 and the second fin group 330 are embedded in the bottom cavity 220, and a connecting cavity 135 is formed beside the first fin group 320 and the second fin group 330. That is, after assembly, the partition 230 divides the bottom chamber 220 into one first microchannel area 134 and two second microchannel areas 136 , and the first microchannel area 134 and the second microchannel area 136 are connected via the connecting chamber 135 .

[0074] The microchannel liquid cooling radiator 100 adopts a structure in which the radiator cover plate 200 and the radiator base plate 300 are spliced ​​and welded, which not only divides the microchannel flow layer into three parts to form a microchannel, but also connects the radiator cover plate 200 and the radiator base plate 300 by welding to ensure the structural strength of the microchannel liquid cooling radiator 100. In addition, a connecting channel 322 is provided between the multiple first fin units 321 in the first fin group 320, and the connecting channel 322 interrupts the flow and thermal boundary layer, which is conducive to strengthening heat exchange.

[0075] When the microchannel liquid-cooled radiator 100 performs heat dissipation work on the heat source 900, the operation process of the liquid working medium is as follows: the heat of the heat source 900 is transferred to the liquid cooling plate body 130 through the heat-conducting bottom plate 310; under the action of the external driving force, the low-temperature liquid working medium enters the inlet diversion chamber 133 downward from the inlet channel 111, and after being diverted in the width direction of the first microchannel area 134 by the inlet diversion chamber 133, it flows downward into the center position of the first microchannel area 134; the liquid working medium in the microchannel of the first microchannel area 134 flows along the microchannel to both ends, during which it absorbs the heat transferred from the main heat source 910, and the temperature of the liquid working medium increases; the liquid working medium flowing out from both ends flows through the connecting chamber 135 into the microchannel of the second microchannel area 136, during which it absorbs the heat transferred from the secondary heat source 920, and after the heat exchange is completed, it passes upward through the outlet confluence chamber 137 into the outlet buffer chamber 138, and then flows upward from the outlet channel 121.

[0076] In the above embodiments, the microchannel liquid-cooled radiator 100 is designed for the first microchannel area 134 in the middle and the second microchannel areas 136 on both sides of the main heat source 910 in the heat source 900, with the secondary heat source 920 on both sides. It should be pointed out that the structure inside the microchannel liquid-cooled radiator 100 can be adaptively adjusted according to the different layouts of the main heat source 910 and the secondary heat source 920 of the heat source 900. More specifically, the layout structure of the first microchannel area 134 and the second microchannel area 136 corresponds to the layout structure of the main heat source 910 and the secondary heat source 920, so that the liquid working medium in the first microchannel area 134 is the main heat source 910 for heat dissipation, and the liquid working medium in the second microchannel area 136 is the secondary heat source 920 for heat dissipation. Here, the main heat source 910 and the secondary heat source 920 can be independent heat sources, or the main heat source 910 and the secondary heat source 920 can also be different areas with different heat generation on the same heat source, which is not limited to this.

[0077] In summary, compared with the prior art, the microchannel liquid cooling radiator provided by the present application has at least the following advantages:

[0078] (1) The first microchannel area and the second microchannel area are designed in combination with the heat source distribution characteristics of integrating multiple heat sources and having large differences in heat generation in different areas. The liquid working fluid enters the first microchannel area first and then enters the second microchannel area, which can preferentially cool the main heat source or the high-heating area of ​​the heat source with large thermal power and heat flux density corresponding to the first microchannel area. The low-temperature working fluid enters the center of the main heat source or the center of the high-heating area of ​​the heat source from the middle of the first microchannel area and reduces the flow of the liquid working fluid, thereby effectively controlling the maximum temperature and temperature uniformity of the main heat source and the secondary heat source, the high-heating area of ​​the heat source and the low-heating area of ​​the heat source, and maximizing the computing power of the chip.

[0079] (2) Along the flow direction of the liquid working medium, the inlet diversion cavity located at the center position gradually increases in the width dimension of the first microchannel area and gradually decreases in the width dimension perpendicular to the first microchannel area. This effectively realizes the on-demand distribution of the liquid working medium and increases the local flow velocity of the liquid working medium, which is beneficial to enhance heat exchange, reduce the maximum temperature and center temperature of the heat source, and improve the temperature uniformity of the heat source surface.

[0080] (3) The design of the gradually shrinking channel width of the microchannel connecting cavity can be used as a diversion structure of the second microchannel area. By adjusting the inclination angle, the flow rate of each microchannel entering the second microchannel area is made uniform, thereby effectively controlling the temperature difference of the secondary heat source and improving the temperature uniformity.

[0081] (4) The various structural parts of the radiator cover and the radiator base plate are assembled as a whole and connected into a whole through welding and other processes. The process is mature, the processing is convenient, and the cost is controllable.

[0082] The concepts described herein may be implemented in other forms without departing from their spirit and characteristics. The specific embodiments disclosed should be considered illustrative rather than restrictive. Therefore, the scope of this application is determined by the appended claims rather than by the preceding description. Any changes within the literal meaning and equivalent scope of the claims should fall within the scope of these claims.

Claims

1. A microchannel liquid cooling radiator, characterized in that: The invention comprises a liquid cooling plate body (130), wherein a cavity for liquid working medium to flow is formed inside the liquid cooling plate body (130), wherein the cavity comprises a first microchannel area (134) and a second microchannel area (136) separated from each other, and a connecting cavity (135) is also provided inside the cavity, wherein the connecting cavity (135) connects the microchannel outlet of the first microchannel area (134) and the microchannel inlet of the second microchannel area (136), so that the liquid working medium flowing out of the first microchannel area (134) enters the second microchannel area (136) via the connecting cavity (135).

2. The microchannel liquid cooling radiator according to claim 1, characterized in that: The first microchannel area (134), the connecting cavity (135) and the second microchannel area (136) are located at the same height layer, and the liquid working medium flows from the middle of the first microchannel area (134) into each microchannel of the first microchannel area (134).

3. The microchannel liquid cooling radiator according to claim 2, characterized in that: The channel width of the connecting cavity (135) gradually decreases from the first microchannel area (134) to the second microchannel area (136).

4. The microchannel liquid cooling radiator according to claim 1, characterized in that: The cavity also includes an inlet flow diversion cavity (133) for liquid working medium to enter the first microchannel area (134); along the flow direction of the liquid working medium, the inlet section of the inlet flow diversion cavity (133) gradually expands relative to the outlet section in the width direction of the first microchannel area (134), and the inlet section of the inlet flow diversion cavity (133) gradually decreases relative to the outlet section in a width direction perpendicular to the first microchannel area (134).

5. The microchannel liquid cooling radiator according to claim 4, characterized in that: The outlet section of the inlet diversion chamber (133) is connected from above to the midpoint of the microchannel of the first microchannel area (134).

6. The microchannel liquid cooling radiator according to claim 1, characterized in that: The first microchannel area (134) is provided with a connecting channel in the flow direction, and the connecting channel is arranged along the width direction of the first microchannel area (134) and connects the microchannels in the width direction.

7. The microchannel liquid cooling radiator according to claim 1, characterized in that: The invention also comprises an inlet joint (110), an outlet joint (120) and a liquid cooling plate body (130); the inlet joint (110) and the outlet joint (120) are vertically arranged on a first surface (131) of the liquid cooling plate body (130); a second surface (132) of the liquid cooling plate body (130) opposite to the first surface (131) is used for contacting a heat source (900); an inlet channel (111) connected to the cavity is formed in the inlet joint (110), and an outlet channel (121) connected to the cavity is formed in the outlet joint (120).

8. The microchannel liquid cooling radiator according to claim 7, characterized in that: The chamber comprises, in order from the flow direction of the liquid working medium, an inlet diversion chamber (133), the first microchannel area (134), the connecting chamber (135), the second microchannel area (136), an outlet confluence chamber (137) and an outlet buffer chamber (138); the inlet diversion chamber (133) is connected to the inlet channel (111), and the outlet buffer chamber (138) is connected to the outlet channel (121).

9. The microchannel liquid cooling radiator according to claim 8, characterized in that: The second microchannel areas (136) are respectively provided on both sides of the first microchannel area (134) in the width direction; the microchannel outlet of each second microchannel area (136) is connected to the outlet confluence chamber (137), and the liquid working fluids in the two outlet confluence chambers (137) converge in the outlet buffer chamber (138).

10. The microchannel liquid cooling radiator according to claim 8, characterized in that: It comprises a radiator cover plate (200) and a radiator base plate (300), wherein the radiator cover plate (200) and the radiator base plate (300) are connected to form a whole; The radiator cover plate (200) comprises a cover body (210), the inlet joint (110) and the outlet joint (120) being arranged on the top surface of the cover body (210); the inlet flow diversion chamber (133), the outlet flow converging chamber (137) and the outlet buffer chamber (138) are respectively formed on the upper layer inside the cover body (210), and the bottom chamber (220) is formed on the lower layer inside the cover body (210); The heat sink substrate (300) comprises a bottom plate (310), a first fin group (320) and a second fin group (330), wherein the first fin group (320) and the second fin group (330) are formed on the upper surface of the bottom plate (310); The bottom surface of the cover body (210) is assembled with the upper surface of the bottom plate (310), and the first fin group (320) and the second fin group (330) are embedded in the bottom cavity (220), so that the first fin group (320) forms the first microchannel area (134), the second fin group (330) forms the second microchannel area (136), and the connecting cavity (135) is formed next to the first fin group (320) and the second fin group (330).

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