Large-scale array microsystem thermal control structure

By designing thermal control structures in large-scale array microsystems, using thermal resistance equivalent heating and high thermal conductivity materials, the problems of heat accumulation and uneven temperature distribution caused by low efficiency of RF chips are solved, and efficient heat dissipation and performance improvement are achieved.

CN119962169APending Publication Date: 2025-05-09BEIJING INST OF REMOTE SENSING EQUIP
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Patent Information

Application Number
CN202411969197.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-05-09

AI Technical Summary

Technical Problem

The low efficiency of RF chips in large-scale array microsystems leads to heat accumulation, resulting in uneven temperature distribution, affecting performance.

Method used

A large-scale array microsystem thermal control structure is designed, including a multi-layer structure microsystem submodule, temperature information acquisition board, structural frame, cover plate and thermal pad. Thermal resistance heating equivalent is used to replace the radio frequency chip, combined with the structure of HTCC ceramic substrate and molybdenum copper plate, and high-thermal conductive materials such as graphene thermal foam and copper alloy are used to achieve efficient heat dissipation.

Benefits of technology

Through this structural design, the problem of uneven temperature distribution can be effectively reduced, the heat dissipation performance of the micro system can be improved, the normal operation of the radio frequency chip, and the temperature uniformity and performance stability of the array micro system can be improved.

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Abstract

The invention discloses a thermal control structure of a large-scale array microsystem, which relates to the technical field of large-scale array microsystems and comprises seven microsystem sub-modules, a temperature information acquisition board, a structural framework, a cover plate and a heat conduction pad. Each microsystem sub-module is of a multi-layer structure, the middle layer is a ceramic carrier plate, an antenna array plane and a thermal resistor used for heating an equivalent chip are welded to the upper layer, and a molybdenum copper plate is welded to the lower layer to serve as a supporting structure; the micro-system sub-module is in threaded connection with the structural frame through a screw hole in the molybdenum copper plate, and the heat conduction pad is located between the micro-system sub-module and the structural frame; the temperature information acquisition board is used for reading the temperature near the thermal resistor and is connected with the micro-system sub-module through a low-frequency connector; the cover plate is in threaded connection with the structural frame, so that the problems that a large-scale array microsystem is poor in temperature uniformity and the performance is affected are solved.
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