Substrate and preparation method thereof, graphics processor board, and electronic equipment

By setting up an alternating barrier layer and conductive layer structure on the surface of the trace, the problem of increased resistance caused by the skin effect in high-frequency signal transmission is solved, and the integrity and reliability of signal transmission are improved.

CN120432464BActive Publication Date: 2025-09-12INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202510897350.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-30
Publication Date
2025-09-12
Estimated Expiration
2045-06-30

AI Technical Summary

Technical Problem

During high-frequency signal transmission, the skin effect causes the resistance of the trace to increase, resulting in signal attenuation and conductor loss, affecting the integrity and reliability of signal transmission.

Method used

An alternating barrier layer and conductive layer structure is set on the surface of the trace, wherein the resistivity of the conductive layer is lower than that of the barrier layer. The barrier layer is used to prevent the diffusion of the conductive material and reduce the resistance of the trace surface.

Benefits of technology

By reducing the surface resistance of the traces, conductor loss is reduced, the integrity of signal transmission and the reliability of system design are improved, and short circuits between adjacent traces are avoided.

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Abstract

The embodiments of the present application provide a substrate and a method for preparing the same, a graphics processor board, and an electronic device, which relate to the field of semiconductor technology and are intended to improve the integrity and reliability of signal transmission. The substrate includes a trace arranged within the substrate, the trace including a first conductive structure and a second conductive structure, the second conductive structure being connected to the surface of the first conductive structure, and the second conductive structure covering at least a portion of the surface of the first conductive structure. Along a first direction from the first conductive structure to the second conductive structure, the second conductive structure includes alternating barrier layers and conductive layers, the resistivity of the conductive layer being less than the resistivity of the barrier layer. The above-mentioned substrate can be used for chip packaging to achieve interconnected signal transmission.
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